參數(shù)資料
型號(hào): MT48H8M16LFB4-8IT:JTR
元件分類: DRAM
英文描述: 8M X 16 SYNCHRONOUS DRAM, 6 ns, PBGA54
封裝: 8 X 8 MM, LEAD FREE, VFBGA-54
文件頁數(shù): 60/61頁
文件大?。?/td> 2469K
PDF: 09005aef8237e877/Source: 09005aef8237e8d8
Micron Technology, Inc., reserves the right to change products or specifications without notice.
128Mb_x16 Mobile SDRAM_Y25M_2.fm - Rev. A 6/06 EN
8
2006 Micron Technology, Inc. All rights reserved.
128Mb: x16 Mobile SDRAM
Functional Description
Preliminary
Functional Description
In general, the 128Mb SDRAMs (2 Meg x 16 x 4 banks) are quad-bank DRAMs that
operate at 1.8V and include a synchronous interface (all signals are registered on the
positive edge of the clock signal, CLK). Each of the x16’s 33,554,432-bit banks is orga-
nized as 4,096 rows by 512 columns by 16 bits.
Read and write accesses to the SDRAM are burst oriented; accesses start at a selected
location and continue for a programmed number of locations in a programmed
sequence. Accesses begin with the registration of an ACTIVE command, which is then
followed by a READ or WRITE command. The address bits registered coincident with the
ACTIVE command are used to select the bank and row to be accessed (BA0 and BA1
select the bank, A0–A11 select the row). The address bits (A0–A8) registered coincident
with the READ or WRITE command are used to select the starting column location for
the burst access.
Prior to normal operation, the SDRAM must be initialized. The following sections
provide detailed information covering device initialization, register definition,
command descriptions and device operation.
Initialization
SDRAMs must be powered up and initialized in a predefined manner. Operational
procedures other than those specified may result in undefined operation. Power should
be applied to VDD and VDDQ simultaneously. Once the power is applied to VDD and
VDDQ, and the clock is stable (stable clock is defined as a signal cycling within timing
constraints specified for the clock pin), the SDRAM requires a 100s delay prior to
issuing any command other than a COMMAND INHIBIT or NOP. Starting at some point
during this 100s period and continuing at least through the end of this period,
command inhibit or NOP commands should be applied.
Once the 100s delay has been satisfied with at least one command inhibit or NOP
command having been applied, a PRECHARGE command should be applied. All banks
must then be precharged, thereby placing the device in the all banks idle state.
Once in the idle state, two AUTO refresh cycles must be performed. After the AUTO
refresh cycles are complete, the SDRAM is ready for mode register programming.
Because the mode register will power up in an unknown state, it should be loaded prior
to applying any operational command.
Mode Register Definition
In order to achieve low power consumption, there are two mode registers in the mobile
component, mode register and extended mode register. The mode register is illustrated
in Figure 4, "Mode Register Definition," on page 11 (the extended mode register is illus-
The mode register defines the specific mode of operation of the SDRAM, including burst
length, burst type, CAS latency, operating mode, and write burst mode. The mode
register is programmed via the LOAD MODE REGISTER command and will retain the
stored information until it is programmed again or the device loses power.
Mode register bits M0–M2 specify the burst length, M3 specifies the type of burst
(sequential or interleaved), M4–M6 specify the CAS latency, M7 and M8 specify the oper-
ating mode, M9 specifies the write burst mode, and M10, and M11 should be set to zero.
M12 and M13 should be set to zero to prevent extended mode register.
相關(guān)PDF資料
PDF描述
MT48LC4M32TG-10 4M X 32 SYNCHRONOUS DRAM, 7 ns, PDSO54
MT48V8M16LFB4-8XT 8M X 16 SYNCHRONOUS DRAM, 7 ns, PBGA54
MT48LC4M32LFB5-10ES:G 4M X 32 SYNCHRONOUS DRAM, 7 ns, PBGA90
MT48V4M32TG-8XT 4M X 32 SYNCHRONOUS DRAM, 7 ns, PDSO54
MT48LC8M8A2TG-8EL:GIT 8M X 8 SYNCHRONOUS DRAM, 6 ns, PDSO54
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MT48H8M16LFF3-7E 制造商:Micron Technology Inc 功能描述:
MT48H8M16LFF4-10 功能描述:IC SDRAM 128MBIT 100MHZ 54VFBGA RoHS:否 類別:集成電路 (IC) >> 存儲(chǔ)器 系列:- 標(biāo)準(zhǔn)包裝:1 系列:- 格式 - 存儲(chǔ)器:RAM 存儲(chǔ)器類型:SDRAM 存儲(chǔ)容量:256M(8Mx32) 速度:143MHz 接口:并聯(lián) 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:90-VFBGA 供應(yīng)商設(shè)備封裝:90-VFBGA(8x13) 包裝:托盤 其它名稱:Q2841869
MT48H8M16LFF4-10 IT 功能描述:IC SDRAM 128MBIT 100MHZ 54VFBGA RoHS:否 類別:集成電路 (IC) >> 存儲(chǔ)器 系列:- 標(biāo)準(zhǔn)包裝:1 系列:- 格式 - 存儲(chǔ)器:RAM 存儲(chǔ)器類型:SDRAM 存儲(chǔ)容量:256M(8Mx32) 速度:143MHz 接口:并聯(lián) 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:90-VFBGA 供應(yīng)商設(shè)備封裝:90-VFBGA(8x13) 包裝:托盤 其它名稱:Q2841869
MT48H8M16LFF4-8 功能描述:IC SDRAM 128MBIT 125MHZ 54VFBGA RoHS:否 類別:集成電路 (IC) >> 存儲(chǔ)器 系列:- 標(biāo)準(zhǔn)包裝:1 系列:- 格式 - 存儲(chǔ)器:RAM 存儲(chǔ)器類型:SDRAM 存儲(chǔ)容量:256M(8Mx32) 速度:143MHz 接口:并聯(lián) 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:90-VFBGA 供應(yīng)商設(shè)備封裝:90-VFBGA(8x13) 包裝:托盤 其它名稱:Q2841869
MT48H8M16LFF4-8 IT 功能描述:IC SDRAM 128MBIT 125MHZ 54VFBGA RoHS:否 類別:集成電路 (IC) >> 存儲(chǔ)器 系列:- 標(biāo)準(zhǔn)包裝:1 系列:- 格式 - 存儲(chǔ)器:RAM 存儲(chǔ)器類型:SDRAM 存儲(chǔ)容量:256M(8Mx32) 速度:143MHz 接口:并聯(lián) 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:90-VFBGA 供應(yīng)商設(shè)備封裝:90-VFBGA(8x13) 包裝:托盤 其它名稱:Q2841869