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參數(shù)資料
| 型號： | MT48H8M16LFB4-8IT:JTR |
| 元件分類： | DRAM |
| 英文描述： | 8M X 16 SYNCHRONOUS DRAM, 6 ns, PBGA54 |
| 封裝： | 8 X 8 MM, LEAD FREE, VFBGA-54 |
| 文件頁數(shù)： | 45/61頁 |
| 文件大?。?/td> | 2469K |
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PDF: 09005aef8237e877/Source: 09005aef8237e8d8
Micron Technology, Inc., reserves the right to change products or specifications without notice.
128Mb_x16 Mobile SDRAM_Y25M_2.fm - Rev. A 6/06 EN
5
2006 Micron Technology, Inc. All rights reserved.
128Mb: x16 Mobile SDRAM
General Description
Preliminary
Figure 2:
Part Numbering Diagram
General Description
The Micron 128Mb SDRAM is a high-speed CMOS, dynamic random-access memory
containing 134,217,728 bits. It is internally configured as a quad-bank DRAM with a
synchronous interface (all signals are registered on the positive edge of the clock signal,
CLK). Each of the x16’s 33,554,432-bit banks is organized as 4,096 rows by 512 columns
by 16 bits.
Read and write accesses to the SDRAM are burst oriented; accesses start at a selected
location and continue for a programmed number of locations in a programmed
sequence. Accesses begin with the registration of an ACTIVE command, which is then
followed by a READ or WRITE command. The address bits registered coincident with the
ACTIVE command are used to select the bank and row to be accessed (BA0, BA1 select
the bank; A0–A11select the row). The address bits registered coincident with the READ
or WRITE command are used to select the starting column location for the burst access.
The SDRAM provides for programmable read or write burst lengths of 1, 2, 4, or 8 loca-
tions with a burst terminate option. An auto precharge function may be enabled to
provide a self-timed row precharge that is initiated at the end of the burst sequence.
The 128Mb SDRAM uses an internal pipelined architecture to achieve high-speed opera-
tion. This architecture is compatible with the 2n rule of prefetch architectures, but it also
allows the column address to be changed on every clock cycle to achieve a high-speed,
fully random access. Precharging one bank while accessing one of the other three banks
will hide the precharge cycles and provide seamless high-speed, random-access opera-
tion.
The 128Mb SDRAM is designed to operate in 1.8V, low-power memory systems. An auto
refresh mode is provided, along with a power-saving, deep power-down mode. All inputs
and outputs are LVTTL-compatible.
VDD/VDDQ
1.8/1.8V
H
Configuration
8 Meg x16
8M16LF
Package
B4
Speed Grade
8ns
9.6ns
-8
-10
None
IT
Operating Temp
Commercial
Industrial
Example Part Number: MT48H8M16LFF4-8 IT
54-ball VFBGA (8mm x 8mm) Lead-Free
–
Configuration
MT48
VDD/
VDDQ
Package
Speed
Temp
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| MT48LC8M8A2TG-8EL:GIT | 8M X 8 SYNCHRONOUS DRAM, 6 ns, PDSO54 |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| MT48H8M16LFF3-7E | 制造商:Micron Technology Inc 功能描述: |
| MT48H8M16LFF4-10 | 功能描述:IC SDRAM 128MBIT 100MHZ 54VFBGA RoHS:否 類別:集成電路 (IC) >> 存儲器 系列:- 標準包裝:1 系列:- 格式 - 存儲器:RAM 存儲器類型:SDRAM 存儲容量:256M（8Mx32） 速度:143MHz 接口:并聯(lián) 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:90-VFBGA 供應商設備封裝:90-VFBGA（8x13） 包裝:托盤 其它名稱:Q2841869 |
| MT48H8M16LFF4-10 IT | 功能描述:IC SDRAM 128MBIT 100MHZ 54VFBGA RoHS:否 類別:集成電路 (IC) >> 存儲器 系列:- 標準包裝:1 系列:- 格式 - 存儲器:RAM 存儲器類型:SDRAM 存儲容量:256M（8Mx32） 速度:143MHz 接口:并聯(lián) 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:90-VFBGA 供應商設備封裝:90-VFBGA（8x13） 包裝:托盤 其它名稱:Q2841869 |
| MT48H8M16LFF4-8 | 功能描述:IC SDRAM 128MBIT 125MHZ 54VFBGA RoHS:否 類別:集成電路 (IC) >> 存儲器 系列:- 標準包裝:1 系列:- 格式 - 存儲器:RAM 存儲器類型:SDRAM 存儲容量:256M（8Mx32） 速度:143MHz 接口:并聯(lián) 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:90-VFBGA 供應商設備封裝:90-VFBGA（8x13） 包裝:托盤 其它名稱:Q2841869 |
| MT48H8M16LFF4-8 IT | 功能描述:IC SDRAM 128MBIT 125MHZ 54VFBGA RoHS:否 類別:集成電路 (IC) >> 存儲器 系列:- 標準包裝:1 系列:- 格式 - 存儲器:RAM 存儲器類型:SDRAM 存儲容量:256M（8Mx32） 速度:143MHz 接口:并聯(lián) 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:90-VFBGA 供應商設備封裝:90-VFBGA（8x13） 包裝:托盤 其它名稱:Q2841869 |
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