- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄360999 > ISP1760 (NXP Semiconductors N.V.) Hi-Speed Universal Serial Bus host controller for embedded applications PDF資料下載
參數(shù)資料
| 型號(hào)： | ISP1760 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Hi-Speed Universal Serial Bus host controller for embedded applications |
| 中文描述： | 高速嵌入式應(yīng)用的通用串行總線主控制器 |
| 文件頁數(shù)： | 96/105頁 |
| 文件大?。?/td> | 449K |
| 代理商： | ISP1760 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁第76頁第77頁第78頁第79頁第80頁第81頁第82頁第83頁第84頁第85頁第86頁第87頁第88頁第89頁第90頁第91頁第92頁第93頁第94頁第95頁當(dāng)前第96頁第97頁第98頁第99頁第100頁第101頁第102頁第103頁第104頁第105頁
9397 750 13257
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet
Rev. 01 — 8 November 2004
96 of 105
Philips Semiconductors
ISP1760
Embedded Hi-Speed USB host controller
16. Soldering
16.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account of
soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is recommended.
16.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215 to 270
°
C depending on solder paste
material. The top-surface temperature of the packages should preferably be kept:
below 225
°
C (SnPb process) or below 245
°
C (Pb-free process)
–
for all BGA, HTSSON..T and SSOP..T packages
–
for packages with a thickness
≥
2.5 mm
–
for packages with a thickness < 2.5 mm and a volume
≥
350 mm
3
so called
thick/large packages.
below 240
°
C (SnPb process) or below 260
°
C (Pb-free process) for packages with a
thickness < 2.5 mm and a volume < 350 mm
3
so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
16.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal results:
Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
For packages with leads on two sides and a pitch (e):
–
larger than or equal to 1.27 mm, the footprint longitudinal axis is
preferred
to be
parallel to the transport direction of the printed-circuit board;
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| ISP1761 | Hi-Speed Universal Serial Bus On-The-Go controller |
| ISP1761BE | Hi-Speed Universal Serial Bus On-The-Go controller |
| ISP1761ET | Hi-Speed Universal Serial Bus On-The-Go controller |
| ISP2100A | Telecommunication IC |
| ISP2100BN4 | Microprocessor |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ISP1760BE | 制造商:NXP Semiconductors 功能描述:CONTROLLER USB HOST SMD LQFP128 制造商:ST-Ericsson 功能描述:IC CONTROLLER USB HOST 128LQFP |
| ISP1760BE,518 | 功能描述:輸入/輸出控制器接口集成電路 USB HOST CONTROLLER RoHS:否 制造商:Silicon Labs 產(chǎn)品: 輸入/輸出端數(shù)量: 工作電源電壓: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-64 封裝:Tray |
| ISP1760BE,551 | 功能描述:輸入/輸出控制器接口集成電路 USB HS HOST CONTRLLR RoHS:否 制造商:Silicon Labs 產(chǎn)品: 輸入/輸出端數(shù)量: 工作電源電壓: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-64 封裝:Tray |
| ISP1760BE,557 | 功能描述:USB 接口集成電路 DO NOT USE ORDER -S OR -T PART RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20 |
| ISP1760BE518 | 制造商:ST-Ericsson 功能描述:IC CONTROLLER USB HOST 128LQFP |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。