參數(shù)資料
型號(hào): FBGA
英文描述: FBGA - FBGA User's Guide. Version 4.2
中文描述: FBGA封裝- FBGA封裝用戶指南。版本4.2
文件頁數(shù): 91/97頁
文件大?。?/td> 2624K
代理商: FBGA
FBGA User’s Guide
90
Version 4.2, November 1, 2002
ORDERING INFORMATION
AMD standard products are available in several packages and operating ranges. The order number (Valid Combination)
is formed by a combination of the following:
To place an order, please contact your local AMD sales representative. For a current list of contacts via the
Internet go to
http://www.amd.com/support/sales.html
Am29LV160D
WC
D
2
2
B
SUBSTRATE TYPE
A
=
B
=
C
=
Top or internal/intermediate layers shorted on the substrate
Bottom layer shorted on the substrate
Wirebond
DAISY CHAIN CONNECTION
1
=
Daisy chain connection is on the die (metal mask)
2
=
Daisy chain connection is on the substrate
SOLDER MASK OPENING AND GROUND PLANE
1
=
No ground plane
2
=
0.25 mm solder mask opening
3
=
0.27 mm solder mask opening
5
=
0.50 mm solder mask opening
6
=
0.55 mm solder mask opening
DAISY CHAIN
PACKAGE TYPES
PB
=
80-ball Fortified Ball Grid Array (
F
BGA)
1.00 mm pitch, 13 x 11 mm package
64-ball Fortified Ball Grid Array (
F
BGA)
1.00 mm pitch, 13 x 11 mm package
48-ball Fine Pitch Ball Grid Array (FBGA)
0.80 mm pitch, 9 x 8 mm package
63-ball Fine Pitch Ball Grid Array (FBGA)
0.80 mm pitch, 12 x 11 mm package
48-ball Fine Pitch Ball Grid Array (FBGA)
0.80 mm pitch, 12 x 6 mm package
PC
=
WC
=
WH
=
WM
=
DEVICE NUMBER/DESCRIPTION
Valid Combinations for BGA Daisy Chain
Density
Package
Order Number
Package Marking
16 Mb
9 x 8 Fine Pitch BGA (WC)
13 x 11 mm Fortified BGA (PB)
AM29LV160DWCD22B
AM29BDD160GPBD62B
LV160DD22B
BDAFGD62B
32 Mb
12 x 6 mm FBGA (WM)
AM29DL323DWMD22B
DL323DD22B
64 Mb
12 x 11 Fine Pitch BGA (WH)
13 x 11 mm Fortified BGA (PC)
AM29DL640DWHD22B
AM29LV640DPCD62B
DL640DD22B
LCEDD62B
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