FBGA User’s Guide
90
Version 4.2, November 1, 2002
ORDERING INFORMATION
AMD standard products are available in several packages and operating ranges. The order number (Valid Combination)
is formed by a combination of the following:
To place an order, please contact your local AMD sales representative. For a current list of contacts via the
Internet go to
http://www.amd.com/support/sales.html
Am29LV160D
WC
D
2
2
B
SUBSTRATE TYPE
A
=
B
=
C
=
Top or internal/intermediate layers shorted on the substrate
Bottom layer shorted on the substrate
Wirebond
DAISY CHAIN CONNECTION
1
=
Daisy chain connection is on the die (metal mask)
2
=
Daisy chain connection is on the substrate
SOLDER MASK OPENING AND GROUND PLANE
1
=
No ground plane
2
=
0.25 mm solder mask opening
3
=
0.27 mm solder mask opening
5
=
0.50 mm solder mask opening
6
=
0.55 mm solder mask opening
DAISY CHAIN
PACKAGE TYPES
PB
=
80-ball Fortified Ball Grid Array (
F
BGA)
1.00 mm pitch, 13 x 11 mm package
64-ball Fortified Ball Grid Array (
F
BGA)
1.00 mm pitch, 13 x 11 mm package
48-ball Fine Pitch Ball Grid Array (FBGA)
0.80 mm pitch, 9 x 8 mm package
63-ball Fine Pitch Ball Grid Array (FBGA)
0.80 mm pitch, 12 x 11 mm package
48-ball Fine Pitch Ball Grid Array (FBGA)
0.80 mm pitch, 12 x 6 mm package
PC
=
WC
=
WH
=
WM
=
DEVICE NUMBER/DESCRIPTION
Valid Combinations for BGA Daisy Chain
Density
Package
Order Number
Package Marking
16 Mb
9 x 8 Fine Pitch BGA (WC)
13 x 11 mm Fortified BGA (PB)
AM29LV160DWCD22B
AM29BDD160GPBD62B
LV160DD22B
BDAFGD62B
32 Mb
12 x 6 mm FBGA (WM)
AM29DL323DWMD22B
DL323DD22B
64 Mb
12 x 11 Fine Pitch BGA (WH)
13 x 11 mm Fortified BGA (PC)
AM29DL640DWHD22B
AM29LV640DPCD62B
DL640DD22B
LCEDD62B