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參數(shù)資料
| 型號(hào)： | FBGA |
| 英文描述： | FBGA - FBGA User＇s Guide. Version 4.2 |
| 中文描述： | FBGA封裝- FBGA封裝用戶指南。版本4.2 |
| 文件頁(yè)數(shù)： | 19/97頁(yè) |
| 文件大小： | 2624K |
| 代理商： | FBGA |
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FBGA User’s Guide
18
Version 4.2, November 1, 2002
System integration and space savings
MCPs are gaining momentum in the industry as a system integration solution. In the cellular
phone market, Flash and SRAM MCP combinations have become very popular. It stacks one
die on top of the other on a rigid BT-substrate. Both chips are wire- bonded to the top of the
substrate and overmolded with encapsulant, solder balls on the bottom of the package
.
This
technology allows companies to immediately take advantage space savings, with either
smaller or more feature rich products.
Two die stacking is typically use if the top die size is small enough not to cover the bond pad of the
bottom die. However, if both dies are similar in size Same-Die-Stacking (SDS) must be use. SDS uses
a spacer-die, between the top die and the bottom, to allow for addiquiet wire bonding space of the
bottom die. SDS provides powerful flexibility to system integration. With SDS, not only can
components of two different application be integrate in single package, same components can also be
integrated to added feature or higher densities, such as Flash+Flash.
Figure 4-3. 2-Die Stack (Flash+SRAM) MCP
Figure 4-4. Same-Die-Stack (SDS) MCP
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