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| 型號： | FBGA |
| 英文描述： | FBGA - FBGA User＇s Guide. Version 4.2 |
| 中文描述： | FBGA封裝- FBGA封裝用戶指南。版本4.2 |
| 文件頁數(shù)： | 51/97頁 |
| 文件大小： | 2624K |
| 代理商： | FBGA |
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FBGA User’s Guide
50
Version 4.2, November 1, 2002
FBGA Thermal Management
Thermal energy management is important in today’s rapidly changing microelectronics. To receive the
best possible performance of any electronic product, proper heat dissipation is crucial. The
temperature at which a microelectronic device operates determines among other things the speed and
reliability of the product. Proper thermal management is achieved when heat is transferred or
dissipated from the device to the system air, which is then vented out of the system. A few of the most
important factors affecting device operation temperature are power dissipation, air temperature,
package construction, and cooling mechanisms. The combinations of these factors determine the
device’s operation temperature.
How well FBGA packages dissipate heat can be measured or described by
θ
JA
, the junction to air
thermal resistance value.
Figure 6-2. Path of Heat Dissipation
θ
JA
– Junction to Air
Referring to Figure 6-2,
θ
JA
describes the path of heat dissipation from the active circuit
surface of the die through the mold compound to the ambient air. The equations that govern
this model are:
θ
JA
=
Ψ
JT
-
Ψ
TA
Ψ
JT
= (T
Jss
– T
Tss
)/P
d
Ψ
TA
= (T
Tss
- T
Ass
)/P
d
Ψ
JT
= Thermal characterization parameter from device junction to the top center of the package
surface (°C/W).
θ
JA
= Package thermal resistance from the die junction to the ambient air (°C/W).
θ
JA
is a
measurement of the package internal thermal resistance as well as the conductive and convective
thermal resistance from the package exterior to the ambient.
Ψ
TA
= Thermal characterization parameter from top surface of the package-to-air (°C/W)
T
Jss
= The junction temperature at steady-state. (
o
C)
DIE
JT
TA
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