- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄370153 > FBGA FBGA - FBGA User＇s Guide. Version 4.2 PDF資料下載
參數(shù)資料
| 型號： | FBGA |
| 英文描述： | FBGA - FBGA User＇s Guide. Version 4.2 |
| 中文描述： | FBGA封裝- FBGA封裝用戶指南。版本4.2 |
| 文件頁數(shù)： | 84/97頁 |
| 文件大?。?/td> | 2624K |
| 代理商： | FBGA |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁第76頁第77頁第78頁第79頁第80頁第81頁第82頁第83頁當前第84頁第85頁第86頁第87頁第88頁第89頁第90頁第91頁第92頁第93頁第94頁第95頁第96頁第97頁
FBGA User’s Guide
Version 4.2, November 1, 2002
83
6
7. “ntegrated Circuit Thermal Test Method Environmental Conditions –Forced Convection (Moving Air), EIA/JESD 51-6,
Electronic Industries Association, 1999
8. “High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages” EIA/JESD 51-7, Electronic
Industries Association, 1999
9. "Accepted Practices for Making Microelectronic Device Thermal Characteristics Tests - A User's Guide," JEDEC
Engineering Bulletin No. 20, Electronic Industries Association, Washington, DC.
10. "Thermal Characteristics," Method 1012.1, MIL-STD-883C Test Methods and Procedures for Microelectronics,
Department of Defense, Washington, DC.
11. "Unencapsulated Thermal Test Chip," SEMI G32-86 Guideline, 1989 Book of SEMI Standards, Vol. 4, Packaging
Division, SEMI, Inc. Mountain View, CA.
12. "Junction-to-Case Thermal Resistance Measurements of Molded-Plastic Packages," SEMI G43-87 Test Method,
1989 Book of SEMI Standards, Vol. 4, Packaging Division, SEMI, Inc. Mountain View, CA.
13. "Thermal Test Board Standardization for Measuring Junction-to-Ambient Thermal Resistance of Semiconductor
Packages," SEMI G42-88 Specification, 1989 Book of SEMI Standards, Vol. 4, Packaging Division, SEMI, Inc.
Mountain View, CA.
14. “Junction-to-Case Thermal Resistance Measurements of Ceramic Packages," SEMI G30-88 Test Method, 1989 Book
of SEMI Standards, Vol. 4, Packaging Division, SEMI, Inc. Mountain View, CA.
15. "Thermal Transient Testing for Die Attachment Evaluation of Integrated Circuits," SEMI G46-88 Test Method, 1989
Book of SEMI Standards, Vol. 4, Packaging Division, SEMI, Inc. Mountain View, CA.
16. "Still-and Forced-Air Junction-to-Ambient Thermal Resistance Measurements of Integrated Circuit Packages," SEMI
G38-87 Test Method, 1989 Book of SEMI Standards, Vol. 4, Packaging Division, SEMI, Inc. Mountain View, CA.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| FBI1.5A4S1 | Bridge Rectifiers (In Line) |
| FBI1.5B4S1 | Bridge Rectifiers (In Line) |
| FBI1.5B5S2 | Bridge Rectifiers (In Line) |
| FBI1.5D4S1 | Bridge Rectifiers (In Line) |
| FBI1.5D5S2 | Bridge Rectifiers (In Line) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| FBGA96T.5-DC144 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:FBGA96T.5-DC144 |
| FBGA-SD | 制造商:STATSCHIP 制造商全稱:STATSCHIP 功能描述:Fine Pitch Ball Grid Array - Stacked Die |
| FBGC-1.44G | 制造商:MERRIMAC 制造商全稱:MERRIMAC 功能描述:FILTER |
| FBGC-2.75G | 制造商:MERRIMAC 制造商全稱:MERRIMAC 功能描述:FILTER |
| FBGC-3-1.4G | 制造商:MERRIMAC 制造商全稱:MERRIMAC 功能描述:FILTER |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。