參數(shù)資料
型號(hào)： FBGA
英文描述： FBGA - FBGA User＇s Guide. Version 4.2
中文描述： FBGA封裝- FBGA封裝用戶指南。版本4.2
文件頁數(shù)： 18/97頁
文件大?。?/td> 2624K
代理商： FBGA
FBGA User’s Guide
Version 4.2, November 1, 2002
17
Chapter 4:
AMD Multi-Chip Packaging
In portable consumer product segment such as Cell phones, PDAs, digital cameras and audio players
there are demands to increase features and functionalities as well as for smaller, thinner product size.
In order to meet these demands, AMD launched a line of MCP (Multi-Chip Package) products.
Through system integration and PCB optimization, MCP enhances system design in numerous ways
such as reduce PCB size, lower PCB cost, reduce components, lighter weight, smaller system, increase
features and customer flexibility.
Package Construction
Figure 4-1. 2-Die MCP Construction
Figure 4-2. Same-Die Stack (SDS) MCP Construction
Solder Ball Pad
DIE
-
2
BT Resin Substrate
(FBGA)
Punch or Drill VIA
Gold
(standard)
1.4 mm MAX
Mold
(standard)
(standard)
0.3, 0.35mm
(FBGA)
DIE
-
1
0.8mm
Solder Mask
Bond Wire
Compound
Die Attach
Solder Ball Pad
DIE-2
BT Resin Substrate
1.0mm
(Fortified-BGA)
Punch or Drill VIA
Gold
(standard)
Mold
(standard)
(standard)
(Fortified-BGA)
DIE-1
Si Spacer
0.8mm
(FBGA)
Solder Mask
Bond Wire
1
1
Compound
Die Attach
0.45mm
(FBGA)
0.6mm
相關(guān)PDF資料
PDF描述
FBI1.5A4S1 Bridge Rectifiers (In Line)
FBI1.5B4S1 Bridge Rectifiers (In Line)
FBI1.5B5S2 Bridge Rectifiers (In Line)
FBI1.5D4S1 Bridge Rectifiers (In Line)
FBI1.5D5S2 Bridge Rectifiers (In Line)
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
FBGA96T.5-DC144 制造商:未知廠家 制造商全稱:未知廠家 功能描述:FBGA96T.5-DC144
FBGA-SD 制造商:STATSCHIP 制造商全稱:STATSCHIP 功能描述:Fine Pitch Ball Grid Array - Stacked Die
FBGC-1.44G 制造商:MERRIMAC 制造商全稱:MERRIMAC 功能描述:FILTER
FBGC-2.75G 制造商:MERRIMAC 制造商全稱:MERRIMAC 功能描述:FILTER
FBGC-3-1.4G 制造商:MERRIMAC 制造商全稱:MERRIMAC 功能描述:FILTER
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*