參數(shù)資料
型號(hào)： FBGA
英文描述： FBGA - FBGA User＇s Guide. Version 4.2
中文描述： FBGA封裝- FBGA封裝用戶指南。版本4.2
文件頁數(shù)： 71/97頁
文件大小： 2624K
代理商： FBGA
FBGA User’s Guide
70
Version 4.2, November 1, 2002
Figure 5. Weibull plots for various SPs
Table 3. Weibull parameters for various SPs
Figure 6. Field life projections
lifetimes considerably higher than the requirements of most
customer applications. The 8x9mm FBGA-PI and 6x9mm
FBGA-Cer data translated to lower field life projections.
The life projections in “years” shown in Figure-6 are for
those two specific field conditions only. The estimation of
lifetimes would vary depending upon the specific field
conditions and the model used to calculate the acceleration
factors between test and field. However, the key
observation to be made is that the relative size of the
different bars is a true representation of the comparative
reliability of the different CSPs at the board level.
The higher reliability of the FBGA-BT package can be
attributed to the thick and rigid BT substrate isolating the
silicon die (low CTE) from the solder joint and the board.
In the case of the MicroBGA package, the compliant
elastomer material isolates the silicon die from the solder
joint and the board, and contributes to the high reliability.
The comparatively lower reliability of the FBGA-PI is due
to the fact that the package construction is dominated by
the low CTE Silicon die. As seen in the package cross
section, it is only the die attach layer and the Copper traces
on the PI substrate that separate the solder ball from the
die. The PI tape itself is not in the path; it has openings
that define the pads for ball attachment. The lower
reliability of the FBGA-Cer packages was expected since
there is both global and local CTE mismatch with the FR-4
board. A potential use of this package might be on
Ceramic boards, but that issue is not discussed in this study.
On completion of the tests, failure analysis was carried out
on a sample of the test vehicles. Figure 7 shows micro-
sections of the FBGA-PI and FBGA-BT test boards. Solder
joint cracks at the interface on the component side are seen.
This is consistent with the classic BGA solder joint failure
mechanism that is well documented in the literature.
Figure 8 shows the results of the failure analysis on some of
the initial MicroBGA failures. A lifted beam lead was
detected. The isolation of the low CTE die by the compliant
elastomer results in the beam leads absorbing most of the
cyclic fatigue stress in temperature cycling.
Figure 7. Failure analysis of FBGA-PI (left) and FBGA
BT (right). Cracks on component side.
Figure 8. Failure analysis of icroBGA
40C / 60C, 1 cyc/day
Comparison of packagesat 100 PPM cume fail
0
20
40
60
80
100
uBGA
8x9mm
FBGA-BT
8x9mm
FBGA-PI
6x9mm
FBGA-Cer
P
-15C / 25C, 1 cyc/day
Comparison of packagesat 100 PPM cume fail
0
20
40
60
80
100
uBGA
8x9mm
FBGA-BT
8x9mm
FBGA-PI
6x9mm
FBGA-Cer
P
Weibull plot for various CSPs
-6.9
-4.6
-2.3
0
2.3
4.6
(100)
6.9
9.2
11.5
Ln(Cycles)
L
8x9 FBGA-BT
8x9 FBGA-PI
6x9 FBGA-Cer
uBGA
63.2%
10%
1%
0.1%
99.99%
(100000)
(10000)
(1000)
Package
N63.2 (cyc)
Beta
# fails / SS
8x9 mm FBGA-BT
8x9 mm FBGA-PI
6x9 mm FBGA-Cer
MicroBGA
11586
2295
1918
9240
5.0
3.9
5.2
4.8
39 / 48
52 / 60
46 / 60
35 / 60
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