參數(shù)資料
型號(hào)： FBGA
英文描述： FBGA - FBGA User＇s Guide. Version 4.2
中文描述： FBGA封裝- FBGA封裝用戶指南。版本4.2
文件頁數(shù)： 83/97頁
文件大小： 2624K
代理商： FBGA
FBGA User’s Guide
82
Version 4.2, November 1, 2002
5
Ψ
JT
= (T
Jss
- T
Tss
)/P
H
(4)
where
Ψ
JT
= thermal characterization parameter from device junction to the top center of the
package surface(
°
C/W)
T
Jss
= the junction temperature at steady-state.
T
Tss
= the package (top surface) temperature, at steady-state, measured by the thermocouple,
infrared sensor, or fluoroptic sensor.
The relationship between the junction-to-ambient thermal resistance,
θ
JA
, and the junction-to-top center of
package thermal characterization parameter,
Ψ
JT
, is described by equation 5:
θ
JA
=
Ψ
JT
+
Ψ
TA
(5)
where
Ψ
TA
= thermal characterization parameter from top surface of the package-to-air (
°
C/W)
The package-to-air thermal characterization parameter,
Ψ
TA
, is based on the steady-state ambient air
temperature as shown here:
Ψ
TA
= (T
Tss
- T
Ass
)/P
H
(6)
The thermal characterization parameters,
Ψ
JT
and
Ψ
TA
, have the units
°
C/W but are mathematical constructs
rather than thermal resistances because not all of the heating power flows through the exposed case surface.
It is not necessary to report
Ψ
TA
because it can be determined from the relationship between
θ
JA
and
Ψ
JT
.
Also,
Ψ
TA
is very dependent on the application-specific environment.
Conclusion
This memo has attempted to educate and inform package, process, and product engineers
in the correct use of temperature measurements on the external surface of the package to
determine junction temperature. If we educate our customers, system level thermal analysis
will be more accurate, allowing a larger application range for our products, especially in
critical situations. Because the measurement is relatively new, we are in the process of
generating
Ψ
J-T
values for all AMD surface mount plastic packages. If a value is needed for a
particular product, please contact the Package Characterization Group in MSD
Engineering.
References
1. "Methodology for the Thermal Measurement of Component Packages (Single Semiconductor Device), EIA/ JESD51
Standard, Electronic Industries Association, 1995
2. "Integrated Circuit Thermal Measurement Method - Electrical Test Method (Single Semiconductor Device),
EIA/JESD 51-1 Standard, Electronic Industries Association, 1995
3. "Integrated Circuit Thermal Test Method Environmenatl Conditions - Natural Convection (Still Air), EIA/JESD 51-2
Standard, Electronic Industries Association, 1995
4. "Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages," EIA/JESD 51-3 Standard,
Electronic Industries Association, 1996
5. "Thermal Test Chip Guideline (Wire Bond Type Chip)," EIA/JESD 51-4 Standard, Electronic Industries Association,
1996
6. “Extension of Thermal Test Board Standards for Packages with Direct Attach Mechanisims” EIA/JESD 51-5,
Electronic Industries Association, 1999
相關(guān)PDF資料
PDF描述
FBI1.5A4S1 Bridge Rectifiers (In Line)
FBI1.5B4S1 Bridge Rectifiers (In Line)
FBI1.5B5S2 Bridge Rectifiers (In Line)
FBI1.5D4S1 Bridge Rectifiers (In Line)
FBI1.5D5S2 Bridge Rectifiers (In Line)
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
FBGA96T.5-DC144 制造商:未知廠家 制造商全稱:未知廠家 功能描述:FBGA96T.5-DC144
FBGA-SD 制造商:STATSCHIP 制造商全稱:STATSCHIP 功能描述:Fine Pitch Ball Grid Array - Stacked Die
FBGC-1.44G 制造商:MERRIMAC 制造商全稱:MERRIMAC 功能描述:FILTER
FBGC-2.75G 制造商:MERRIMAC 制造商全稱:MERRIMAC 功能描述:FILTER
FBGC-3-1.4G 制造商:MERRIMAC 制造商全稱:MERRIMAC 功能描述:FILTER
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號(hào)，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購

我的聯(lián)系方式

*
*
*