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參數(shù)資料
| 型號： | FBGA |
| 英文描述： | FBGA - FBGA User＇s Guide. Version 4.2 |
| 中文描述： | FBGA封裝- FBGA封裝用戶指南。版本4.2 |
| 文件頁數(shù)： | 60/97頁 |
| 文件大?。?/td> | 2624K |
| 代理商： | FBGA |
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FBGA User’s Guide
Version 4.2, November 1, 2002
59
Data Retention Bake
This test ensures that the device loses no data. Test is performed at constant temperature with a specific
duration, example, 150°C for 168 hours.
HTOL
High Temperature Operating Life (HTOL) is sometimes refer to as Infant Mortality. This test is used to
weed out any early life failures and is typically performed for 168 hours at 150°C.
Latch-up
To withstand accidental shorting, all the device pins must meet the specification requirements to
withstand up to 200 mA stress from –1 V to V
CC
+ 1 V.
ESD
Electrostatic Discharge (ESD) test the sensitivity of the device. Two kinds of ESD tests are:
HBM
: Human Body Model simulates the ESD event from a human finger to a pin
CDM:
Charge Device Model simulates the spark between a single pin of a charged leadframe and a
metallic ground.
Component level testing consists of but is not limited to the above accelerated tests. As it is not
feasible to monitor the reliability of each device types that AMD produces, device representative and
extend of test are selected based on complexity of wafer fabrication process and package type.
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