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參數(shù)資料
| 型號： | 28F1602C3 |
| 廠商： | Intel Corp. |
| 英文描述： | 3 Volt Advanced+ Stacked Chip Scale Package Memory(3V閃速存儲器和靜態(tài)存儲器) |
| 中文描述： | 3伏高級堆疊芯片級封裝存儲器（3V的閃速存儲器和靜態(tài)存儲器） |
| 文件頁數(shù)： | 1/62頁 |
| 文件大小： | 538K |
| 代理商： | 28F1602C3 |
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E
PRODUCT PREVIEW
June 1999
Order Number: 290666-003
16-Mbit Flash + 2-Mbit SRAM -- 28F1602C3
32-Mbit Flash + 4-Mbit SRAM -- 28F3204C3
n
Flash Memory Plus SRAM
Reduces Board Design Complexity
n
Stacked Die, Chip Scale Package
Smallest Possible Memory
Subsystem Footprint
16-Mbit Flash + 2-Mbit SRAM: 8 mm
by 10 mm Area, 1.4 mm Height
32-Mbit Flash + 4-Mbit SRAM: 8 mm
by 12 mm Area, 1.4 mm Height
n
Industry Compatibility
Sourcing Flexibility
n
Advanced SRAM Technology
70 ns Access Time
Low Power Consumption with
30 mA Read and 0.5
μ
A Standby
Current
n
Flash Data Integrator (FDI) Software
Support
Real-Time Data Storage and Code
Execution from the Same Device
No Constraints on Code/Data
Partition Size
Full Flash File Manager Capability
n
3 Volt Advanced+ Boot Block Flash
Memory
90 ns 16-Mb Access Time at 2.7 V
100 ns 32-Mb Access Time at 2.7 V
Low Power Consumption with
9 mA Read and 10
μ
A Standby
Current
Improved 12 V Production
Programming
Optimized Block Sizes for
Code+Data Storage with 8-Kbyte
Parameter and 64-Kbyte Main
Blocks
Ultra Fast Program and Erase
Suspend for Code+Data Storage in
Real-Time Applications
Flexible, Instantaneous Individual
Block Locking
128-bit Flexible Protection Register
Minimum 100,000 Erase Cycles per
Block
Manufactured on 0.25
μ
ETOX VI
Flash Technology with a Path to
0.18
μ
Process
n
Extended Temperature Operation
–40 °C to +85 °C
The 3 Volt Advanced+ Stacked Chip Scale Package (Stacked-CSP) memory delivers a feature-rich solution
for low-power applications. Stacked-CSP memory devices incorporate flash memory and static RAM in one
package with low voltage capability to achieve the smallest system memory solution form-factor together with
high-speed, low-power operations. The flash memory offers a protection register and flexible block locking to
enable next generation security capability. Combined with the Intel-developed Flash Data Integrator (FDI)
software, the Stacked-CSP memory provides you with a cost-effective, flexible, code plus data storage
solution.
3 VOLT ADVANCED+ STACKED
CHIP SCALE PACKAGE MEMORY
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 28F3204C3 | 3 V Advanced+ Stacked Chip Scale Package Memory(3V高級堆芯片封裝存儲器) |
| 28F1604C3 | 3 Volt Advanced+ Stacked Chip Scale Package Memory(3V閃速存儲器和靜態(tài)存儲器) |
| 28F160C18 | 1.8V Advanced+ Boot Block Flash Memory(1.8V高級引導(dǎo)塊閃速存儲器) |
| 28F160C2 | 2.4V Advanced+ Boot Block Flash Memory(2.4V高級引導(dǎo)塊閃速存儲器) |
| 28F800C2 | 2.4V Advanced+ Boot Block Flash Memory(2.4V高級引導(dǎo)塊閃速存儲器) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 28F160B3 | 制造商:INTEL 制造商全稱:Intel Corporation 功能描述:SMART 3 ADVANCED BOOT BLOCK 4-, 8-, 16-, 32-MBIT FLASH MEMORY FAMILY |
| 28F160BJHE-BTLTH | 制造商: 功能描述: 制造商:undefined 功能描述: |
| 28F160C3 | 制造商:INTEL 制造商全稱:Intel Corporation 功能描述:3 Volt Intel Advanced+ Boot Block Flash Memory |
| 28F160C3BA90 | 制造商: 功能描述: 制造商:Intel 功能描述: 制造商:undefined 功能描述: |
| 28F160C3TD70 | 制造商: 功能描述: 制造商:undefined 功能描述: |
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