
QPro Virtex 2.5V QML High-Reliability FPGAs
2
1-800-255-7778
Preliminary Product Specification
R
Virtex Electrical Characteristics
Based on preliminary characterization. Further changes are not expected.
All specifications are representative of worst-case supply voltage and junction temperature conditions. The parameters
included are common to popular designs and typical applications. Contact the factory for design considerations requiring
more detailed information.
Virtex DC Characteristics
Absolute Maximum Ratings
Table 1: QPro Virtex Field-Programmable Gate Array Family Members
Device
System Gates
CLB Array
Logic Cells
Maximum
Available I/O
Block RAM Bits
Max Select
RAM Bits
XQV100
108,904
20 x 30
2,700
180
40,960
38,400
XQV300
322,970
32 x 48
6,912
316
65,536
98,304
XQV600
661,111
48 x 72
15,552
316
98,304
221,184
XQV1000
1,124,022
64 x 96
27,648
404
131,072
393,216
Symbol
Description
Min/Max
Units
VCCINT
Supply voltage relative to GND
–0.5 to 3.0
V
VCCO
Supply voltage relative to GND
–0.5 to 4.0
V
VREF
Input reference Voltage
–0.5 to 3.6
V
VIN(3)
Input voltage relative to GND
Using VREF
–0.5 to 3.6
V
Internal threshold
–0.5 to 5.5
V
VTS
Voltage applied to 3-state output
–0.5 to 5.5
V
VCC
Longest supply voltage rise time from 1V to 2.375V
50
ms
TSTG
Storage temperature (ambient)
–65 to +150
°C
TJ
Junction temperature
Ceramic packages
+150
°C
Plastic packages
+125
°C
Notes:
1.
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions
is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time may affect device reliability.
2.
Power supplies may turn on in any order.
3.
For protracted periods (e.g., longer than a day), VIN should not exceed VCCO by more that 3.6V.