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參數資料
| 型號： | HB52E89EM |
| 廠商： | Hitachi,Ltd. |
| 英文描述： | 64 MB Unbuffered SDRAM DIMM(64MB 未緩沖同步DRAM DIMM) |
| 中文描述： | 64 MB的無緩沖SDRAM的內存（64MB的未緩沖同步的DRAM內存） |
| 文件頁數： | 53/64頁 |
| 文件大?。?/td> | 2741K |
| 代理商： | HB52E89EM |
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HB52E88EM-F, HB52E89EM-F, HB52E168EN-F, HB52E169EN-F
53
Others
Power-down mode:
The SDRAM module enters power-down mode when CKE goes Low in the IDLE state.
In power down mode, power consumption is suppressed by deactivating the input initial circuit. Power down
mode continues while CKE is held Low. In addition, by setting CKE to High, the SDRAM module exits from
the power down mode, and command input is enabled from the next clock. In this mode, internal refresh is
not performed.
Clock suspend mode:
By driving CKE to Low during a bank-active or read/write operation, the SDRAM
module enters clock suspend mode. During clock suspend mode, external input signals are ignored and the
internal state is maintained. When CKE is driven High, the SDRAM module terminates clock suspend mode,
and command input is enabled from the next clock. For details, refer to the "CKE Truth Table".
Power-up sequence:
The SDRAM module should be gone on the following sequence with power up.
The CK, CKE, S, DQMB and DQ pins keep low till power stabilizes.
The CK pin is stabilized within 100
μ
s after power stabilizes before the following initialization sequence.
The CKE and DQMB is driven to high between power stabilizes and the initialization sequence.
This SDRAM module has V
CC
clamp diodes for CK, CKE, S, DQMB and DQ pins. If these pins go high
before power up, the large current flows from these pins to V
CC
through the diodes.
Initialization sequence:
When 200
μ
s or more has past after the above power-up sequence, all banks must
be precharged using the precharge command (PALL). After t
RP
delay, set 8 or more auto refresh commands
(REF). Set the mode register set command (MRS) to initialize the mode register. We recommend that by
keeping DQMB to High, the output buffer becomes High-Z during Initialization sequence, to avoid DQ bus
contention on memory system formed with a number of device.
V
CC
Power up sequence
Initialization sequence
100
μ
s
0 V
Low
Low
Low
CKE, DQMB
CK
S
, DQ
200
μ
s
Power stabilize
相關PDF資料 |
PDF描述 |
|---|---|
| HB52E169E12 | 128 MB Registered SDRAM DIMM(128 MB 寄存同步DRAM DIMM) |
| HB52E648EN | 512 MB Unbuffered SDRAM DIMM(512 MB 未緩沖同步DRAM DIMM) |
| HB52E649EN | 512 MB Unbuffered SDRAM DIMM(512 MB 未緩沖同步DRAM DIMM) |
| HB52E649E12 | THERMISTOR, NTC; Series:B575; Thermistor type:NTC; Resistance:10kR; Tolerance, resistance:+/-1%; Beta value:3450; Temperature, lower limit, beta value:0(degree C); Temperature, upper limit, beta value:100(degree C); Temp, op. RoHS Compliant: Yes |
| HB52E649E12-A6B | 512 MB Registered SDRAM DIMM 64-Mword 】 72-bit, 100 MHz Memory Bus, 1-Bank Module (18 pcs of 64 M 】 4 Components) PC100 SDRAM |
相關代理商/技術參數 |
參數描述 |
|---|---|
| HB52E89EM-B6 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x72 SDRAM Module |
| HB52F168GB-75B | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x64 SDRAM Module |
| HB52F168GB-75BL | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x64 SDRAM Module |
| HB52F168GB-B | 制造商:ELPIDA 制造商全稱:Elpida Memory 功能描述:128 MB Unbuffered SDRAM Micro DIMM 16-Mword × 64-bit, 133/100 MHz Memory Bus, 1-Bank Module (4 pcs of 16 M × 16 components) PC133/100 SDRAM |
| HB52F328DC-75B | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x64 SDRAM Module |
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