參數(shù)資料
型號(hào): BX80546KG3600FA
廠商: INTEL CORP
元件分類: 微控制器/微處理器
英文描述: 64-BIT, 3600 MHz, MICROPROCESSOR, CPGA604
封裝: FLIP CHIP, MICRO PGA-604
文件頁數(shù): 9/106頁
文件大?。?/td> 4724K
代理商: BX80546KG3600FA
106
Datasheet
Debug Tools Specifications
9.3.1
Mechanical Considerations
The LAI is installed between the processor socket and the processor. The LAI pins plug into the
socket, while the processor pins plug into a socket on the LAI. Cabling that is part of the LAI
egresses the system to allow an electrical connection between the processor and a logic analyzer.
The maximum volume occupied by the LAI, known as the keepout volume, as well as the cable
egress restrictions, should be obtained from the logic analyzer vendor. System designers must
make sure that the keepout volume remains unobstructed inside the system. Note that it is possible
that the keepout volume reserved for the LAI may include differerent requirements from the space
normally occupied by the heatsink. If this is the case, the logic analyzer vendor will provide a
cooling solution as part of the LAI.
9.3.2
Electrical Considerations
The LAI will also affect the electrical performance of the front side bus, therefore it is critical to
obtain electrical load models from each of the logic analyzer vendors to be able to run system level
simulations to prove that their tool will work in the system. Contact the logic analyzer vendor for
electrical specifications and load models for the LAI solution they provide.
相關(guān)PDF資料
PDF描述
BU-63925D0-301 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CQIP70
BU-63925F0-300 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CDFP70
BU-63925G3-201 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CDSO70
BU-64703B3-200 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CBGA80
BU-64703B8-192 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CBGA80
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