參數(shù)資料
型號(hào)： BX80546KG3600FA
廠商： INTEL CORP
元件分類： 微控制器/微處理器
英文描述： 64-BIT, 3600 MHz, MICROPROCESSOR, CPGA604
封裝： FLIP CHIP, MICRO PGA-604
文件頁(yè)數(shù)： 78/106頁(yè)
文件大?。?/td> 4724K
代理商： BX80546KG3600FA
Datasheet
73
Thermal Specifications
NOTES:
1. Thermal Profile A is representative of a volumetrically unconstrained platform. Please refer to Table 6-2 for
discrete points that constitute the thermal profile.
2. Implementation of Thermal Profile A should result in virtually no TCC activation. Furthermore, utilization of
thermal solutions that do not meet processor Thermal Profile A will result in increased probability of TCC
activation and may incur measurable performance loss. (See Section 6.2 for details on TCC activation).
3. Thermal Profile B is representative of a volumetrically constrained platform. Please refer to Table 6-3 for
discrete points that constitute the thermal profile.
4. Implementation of Thermal Profile B will result in increased probability of TCC activation and may incur
measurable performance loss. Furthermore, utilization of thermal solutions that do not meet Thermal Profile
B do not meet the processor’s thermal specifications and may result in permanent damage to the processor.
5. Refer to the 64-bit Intel Xeon Processor with 2 MB L2 Cache Thermal/Mechanical Design Guidelines for
system and environmental implementation details.
Figure 6-1. 64-bit Intel Xeon Processor with 2 MB L2 Cache Thermal Profiles
A and B (PRB = 1)
0
10
20
30
40
50
60
70
80
90
0
1020
30405060
7080
90
100
110
120
Power [W]
T
c
a
se
[
°C]
PCONTROL_BASE_B
PCONTROL_BASE_A
TCASE MAX_B @
TDP
TCASE MAX_A @
TDP
TCASE MAX @
PCONTROL_BASE
Thermal Profile B
y = 0.320 * x +43.4
Thermal Profile A
y = 0.270 * x +43.1
TCASE_MAX_B is a thermal
solution design point. In
actuality, units will not
exceed TCASE_MAX_A due to
TCC activation.
TDP
0
10
20
30
40
50
60
70
80
90
0
1020
30405060
7080
90
100
110
120
Power [W]
T
c
a
se
[
°C]
PCONTROL_BASE_B
PCONTROL_BASE_A
TCASE MAX_B @
TDP
TCASE MAX_A @
TDP
TCASE MAX @
PCONTROL_BASE
Thermal Profile B
y = 0.320 * x +43.4
Thermal Profile A
y = 0.270 * x +43.1
TCASE_MAX_B is a thermal
solution design point. In
actuality, units will not
exceed TCASE_MAX_A due to
TCC activation.
TDP
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