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參數(shù)資料
| 型號(hào)： | BX80546KG3600FA |
| 廠商： | INTEL CORP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 64-BIT, 3600 MHz, MICROPROCESSOR, CPGA604 |
| 封裝： | FLIP CHIP, MICRO PGA-604 |
| 文件頁數(shù)： | 6/106頁 |
| 文件大?。?/td> | 4724K |
| 代理商： | BX80546KG3600FA |
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Datasheet
103
Boxed Processor Specifications
This section describes the cooling requirements of the heatsink solution utilized by the boxed
processor.
8.3.2
Boxed Processor Cooling Requirements
As previously stated the boxed processor will be available in three product configurations. Each
configuration will require unique design considerations. Meeting the processor’s temperature
specifications is also the function of the thermal design of the entire system, and ultimately the
responsibility of the system integrator. The processor temperature specifications are found in
Section 6 of this document.
8.3.2.1
1U Passive CEK Heatsink (1U Form Factor)
In the 1U configuration it is assumed that a chassis duct will be implemented to provide 15 CFM of
airflow to pass through the heatsink fins. The duct should be designed as precisely as possible and
should not allow any air to bypass the heatsink (0” bypass) and a back pressure of 0.38 in. H2O. It
is assumed that a 40
° C T
LA is met. This requires a superior chassis design to limit the TRISE at or
below 5
° C with an external ambient temperature of 35 ° C. Following these guidelines will allow
the designer to meet Thermal Profile B and conform to the thermal requirements of the processor.
8.3.2.2
2U Passive CEK Heatsink (2U and above Form Factor)
Once again a chassis duct is required for the 2U passive heatsink. In this configuration Thermal
Profile A (see Chapter 6) should be followed by supplying 22 CFM of airflow through the fins of
the heatsink with a 0” or no duct bypass and a back pressure of 0.14 in. H2O. The TLA temperature
of 40
° C should be met. This may require the use of superior design techniques to keep T
RISE at or
below 5
° C based on an ambient external temperature of 35 ° C.
8.3.2.3
2U+ Active CEK Thermal Solution (2U+ and above Pedestal)
This thermal solution was designed to help pedestal chassis users to meet the thermal processor
requirements without the use of chassis ducting. It may be necessary to implement some form of
chassis air guide or air duct to meet the TLA temperature of 40 ° C depending on the pedestal
chassis layout. Also, while the active thermal solution is designed to mechanically fit into a 2U
chassis, it may require additional space at the top of the thermal solution to allow sufficient airflow
into the heatsink fan. Therefore, additional design criteria may need to be considered if this thermal
solution is used in a 2U rack mount chassis, or in a chassis that has drive bay obstructions above the
inlet to the fan heatsink.
Table 8-4. Fan Cable Connector Supplier and Part Number
Vendor
3-Pin Connector Part Number
4-Pin Connector Part Number
AMP*
Fan Connector: 643815-3
Header: 640456-3
N/A
Walden*
Molex*
Fan Connector: 22-01-3037
Header: 22-23-2031
Fan Connector: 47054-1000
Header: 47053-1000
Wieson*
N/A
Fan Connector: 2510C888-001
Header: 2366C888-007
Foxconn*
N/A
Fan Connector: N/A
Header: HF27040-M1
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