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參數(shù)資料
| 型號： | BX80546KG3600FA |
| 廠商： | INTEL CORP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 64-BIT, 3600 MHz, MICROPROCESSOR, CPGA604 |
| 封裝： | FLIP CHIP, MICRO PGA-604 |
| 文件頁數(shù)： | 100/106頁 |
| 文件大?。?/td> | 4724K |
| 代理商： | BX80546KG3600FA |
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Datasheet
93
Boxed Processor Specifications
NOTE:
1. The heatsink in this image is for reference only, and may not represent any of the actual boxed processor
heatsinks.
2. The screws, springs, and standoffs will be captive to the heatsink. This image shows all of the components in
an exploded view.
3. It is intended that the CEK spring will ship with the base board and be pre-attached prior to shipping.
8.2
Mechanical Specifications
This section documents the mechanical specifications of the boxed processor.
8.2.1
Boxed Processor Heatsink Dimensions (CEK)
The boxed processor will be shipped with an unattached thermal solution. Clearance is required
around the thermal solution to ensure unimpeded airflow for proper cooling. The physical space
requirements and dimensions for the boxed processor and assembled heatsink are shown in
the 4-pin server board fan header and 4-pin connector used for the active CEK fan heatsink
solution.
Figure 8-4. Passive 64-bit Intel Xeon Processor with 2 MB L2 Cache Thermal
Solution (2U and Larger)
Heat sink
Heat sink standoffs
Heat sink screw
springs
Thermal Interface
Material
Heat sink
screws
Motherboard
and
processor
Chassis pan
Protective Tape
CEK spring
Heat sink
Heat sink standoffs
Heat sink screw
springs
Thermal Interface
Material
Heat sink
screws
Motherboard
and
processor
Chassis pan
Protective Tape
CEK spring
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| BU-63925G3-201 | 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CDSO70 |
| BU-64703B3-200 | 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CBGA80 |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| BX80546KG3600FUS L8P3 | 制造商:Intel 功能描述:MPU XEON NETBURST 64BIT 90NM 3.6GHZ 604PIN FCMPGA4 - Boxed Product (Development Kits) |
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| BX80546PG3000E S L7PM | 制造商:Intel 功能描述: |
| BX80546PG3000E S L8JZ | 制造商:Intel 功能描述: |
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