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參數(shù)資料
| 型號： | BX80546KG3600FA |
| 廠商： | INTEL CORP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 64-BIT, 3600 MHz, MICROPROCESSOR, CPGA604 |
| 封裝： | FLIP CHIP, MICRO PGA-604 |
| 文件頁數(shù)： | 42/106頁 |
| 文件大?。?/td> | 4724K |
| 代理商： | BX80546KG3600FA |
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40
Datasheet
Mechanical Specifications
3.4
Package Handling Guidelines
Table 3-2 includes a list of guidelines on a package handling in terms of recommended maximum
loading on the processor IHS relative to a fixed substrate. These package handling loads may be
experienced during heatsink removal.
NOTES:
1. A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top surface.
2. A tensile load is defined as a pulling load applied to the IHS in a direction normal to the IHS surface.
3. A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal to the IHS top
surface.
4. These guidelines are based on limited testing for design characterization and incidental applications (one
time only).
5. Handling guidelines are for the package only and do not include the limits of the processor socket.
3.5
Package Insertion Specifications
The processor can be inserted and removed 15 times from an mPGA604 socket, which meets the
criteria outlined in the mPGA604 Socket Design Guidelines.
3.6
Processor Mass Specifications
The typical mass of the 64-bit Intel Xeon processor with 2 MB L2 cache is 25 grams [0.88 oz.].
This mass [weight] includes all components which make up the entire processor product.
3.7
Processor Materials
The processor is assembled from several components. The basic material properties are described
in Table 3-3.
Table 3-2. Package Handling Guidelines
Parameter
Maximum Recommended
Notes
Shear
356 N
80 lbf
1,4,5
Tensile
156 N
35 lbf
2,4,5
Torque
8 N-m
70 lbf-in
3,4,5
Table 3-3. Processor Materials
Component
Material
Integrated Heat Spreader (IHS)
Nickel over copper
Substrate
Fiber-reinforced resin
Substrate Pins
Gold over nickel
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