參數(shù)資料
型號(hào)： BX80546KG3600FA
廠商： INTEL CORP
元件分類(lèi)： 微控制器/微處理器
英文描述： 64-BIT, 3600 MHz, MICROPROCESSOR, CPGA604
封裝： FLIP CHIP, MICRO PGA-604
文件頁(yè)數(shù)： 82/106頁(yè)
文件大小： 4724K
代理商： BX80546KG3600FA
Datasheet
77
Thermal Specifications
NOTES:
1. These values are specified at VCC_MAX for all processor frequencies. Systems must be designed to ensure
the processor is not to be subjected to any static VCC and ICC combination wherein VCC exceeds VCC_MAX at
specified ICC. Please refer to the VCC static and transient tolerance specifications in Section 2.
2. Listed frequencies are not necessarily committed production frequencies.
3. Maximum Power is the maximum thermal power that can be dissipated by the processor through the
integrated heat spreader (IHS). Maximum Power is measured at maximum TCASE.
4. Thermal Design Power (TDP) should be used for processor/chipset thermal solution design targets. TDP is
not the maximum power that the processor can dissipate. TDP is measured at maximum TCASE.
5. These specifications are based on pre-silicon estimates.
6. Power specifications are defined at all VIDs found in Table 2-3. The 64-bit Intel
Xeon LV processor may
be shipped under multiple VIDs listed for each frequency.
NOTES:
1. Please refer to Table 6-8 for discrete points that constitute the thermal profile.
2. Utilization of thermal solutions that do not meet the Thermal Profile do not meet the processor’s thermal
specifications and may result in permanent damage to the processor.
Table 6-7. 64-bit Intel Xeon LV 3 GHz Processor Thermal Specifications
Core
Frequency
(GHz)
Maximum
Power
(W)
Thermal
Design Power
(W)
Minimum
TCASE
(°C)
Maximum
TCASE
(°C)
Notes
3 GHz
(PRB = 1)
60
55
5
1,2,3,4,5,6
Figure 6-3. 64-bit Intel Xeon LV Processor Thermal Profiles A and B (PRB = 0)
0
10
20
30
40
50
60
70
80
90
0
5
10
15
20
25
30
35
40
45
50
55
60
Power [W]
T
c
ase
[
°C
]
TCASE MAX @
TDP
Thermal Profile
Y = 0.55 * x +55
TDP
0
10
20
30
40
50
60
70
80
90
0
5
10
15
20
25
30
35
40
45
50
55
60
Power [W]
T
c
ase
[
°C
]
TCASE MAX @
TDP
Thermal Profile
Y = 0.55 * x +55
TDP
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