參數(shù)資料
型號: BX80546KG3600FA
廠商: INTEL CORP
元件分類: 微控制器/微處理器
英文描述: 64-BIT, 3600 MHz, MICROPROCESSOR, CPGA604
封裝: FLIP CHIP, MICRO PGA-604
文件頁數(shù): 7/106頁
文件大?。?/td> 4724K
代理商: BX80546KG3600FA
104
Datasheet
Boxed Processor Specifications
Thermal Profile A should be used to help determine the thermal performance of the platform.
Once again it is recommended that the ambient air temperature outside of the chassis be kept at or
below 35
° C. The air passing directly over the processor thermal solution should not be preheated
by other system components. Meeting the processor’s temperature specification is the
responsibility of the system integrator.
8.4
Boxed Processor Contents
A direct chassis attach method must be used to avoid problems related to shock and vibration, due
to the weight of the thermal solution required to cool the processor. The board must not bend
beyond specification in order to avoid damage. The boxed processor contains the components
necessary to solve both issues. The boxed processor will include the following items:
64-bit Intel Xeon processor with 2 MB L2 cache or 64-bit Intel Xeon LV 3 GHz processor
Unattached (Active or Passive) Thermal Solution
Four screws, four springs, and four heatsink standoffs (all captive to the heatsink)
Thermal Interface Material (pre-applied on heatsink)
Installation Manual
Intel Inside Logo
The other items listed in Figure 8-4 that are required to compete this solution will be shipped with
either the chassis or boards. They are as follows:
CEK Spring (supplied by baseboard vendors)
Heatsink Standoffs (supplied by chassis vendors)
相關PDF資料
PDF描述
BU-63925D0-301 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CQIP70
BU-63925F0-300 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CDFP70
BU-63925G3-201 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CDSO70
BU-64703B3-200 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CBGA80
BU-64703B8-192 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CBGA80
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