參數(shù)資料
型號(hào): Alpha 21164
廠商: SAMSUNG SEMICONDUCTOR CO. LTD.
英文描述: Alpha Microprocessor(64位微處理器)
中文描述: 阿爾法微處理器(64位微處理器)
文件頁數(shù): 104/115頁
文件大?。?/td> 846K
代理商: ALPHA 21164
104
Electrical Data
Power Supply Considerations
11.5.1 Decoupling
The effectiveness of decoupling capacitors depends on the amount of inductance
placed in series with them. The inductance depends both on the capacitor style (con-
struction) and on the module design. In general, the use of small, high-frequency
capacitors placed close to the chip package’s power and ground pins with very short
module etch will give best results. Depending on the user’s power supply and power
supply distribution system, bulk decoupling may also be required on the module.
The 21164 requires two sets of decoupling capacitors: one for
Vdd
and one for
Vddi
.
11.5.1.1 Vdd Decoupling
The amount of decoupling capacitance connected between
Vdd
and
Vss
should be
roughly equal to 10 times the amount of capacitive load that the 21164 is required to
drive at any one time. This should guarantee a voltage drop of no more than 10% on
Vdd
during heavy drive conditions.
Use capacitors that are as physically small as possible. Connect the capacitors
directly to the 21164
Vdd
and
Vss
pins by short surface etch (0.64 cm [0.25 in] or
less). The small capacitors generally have better electrical characteristics than the
larger units and will more readily fit close to the IPGA pin field.
When designing the placement of decoupling capacitors,
Vdd
decoupling capacitors
should be favored over
Vddi
decoupling capacitors (that is,
Vdd
capacitors should
be placed closer to the 21164 than the
Vddi
capacitors).
11.5.1.2 Vddi Decoupling
Each individual case must be separately analyzed, but generally designers should
plan to use at least 4 μF of capacitance connected between
Vddi
and
Vss
. Typically,
30 to 40 small, high-frequency 0.1-μF capacitors are placed near the chip’s
Vddi
and
Vss
pins. Actually placing the capacitors in the pin field is the best approach. Several
tens of μF of bulk decoupling (comprised of tantalum and ceramic capacitors) should
be positioned near the 21164 chip.
Use capacitors that are as physically small as possible. Connect the capacitors
directly to the 21164
Vddi
and
Vss
pins by short surface etch (0.64 cm [0.25 in] or
less). The small capacitors generally have better electrical characteristics than the
larger units, and will more readily fit close to the IPGA pin field.
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