Electrical Specifications
Technical Data
MC68HC08AZ32A — Rev 1.0
436
Electrical Specifications
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MOTOROLA
24.14 Mechanical Specifications
24.14.1 64-pin Quad Flat Pack (QFP)
Figure 24-3. 64-pin QFP (Case #840B)
0.20 M C A
–
B S D S
0.05 A
–
B
L
33
48
16
1
32
17
49
64
- B -
B
V
- D -
A
S
0.20 M H A
–
B S D S
L
- A -
Detail
“
A
”
B
B
- A, B, D -
P
Detail
“
A
”
F
N
J
D
Section B
–
B
Base
Metal
G
H
E
C
-C-
Seating
Plane
M
Detail
“
C
”
M
-H-Plane
U
T
R
Q
K
W
X
Dim.
A
B
C
D
E
F
G
H
J
K
L
Min.
13.90
13.90
2.15
0.30
2.00
0.30
Max.
14.10
14.10
2.45
0.45
2.40
0.40
Notes
Dim.
M
N
P
Q
R
S
T
U
V
W
X
Min.
5
°
0.13
Max.
10
°
0.17
1. DatumPlane
–
H
–
is located at bottomof lead and is coincident with
the lead where the lead exits the plastic body at the bottomof the
parting line.
2. Datums A
–
B and
–
D to be determned at DatumPlane
–
H
–
.
3. Dimensions S and V to be determned at seating plane
–
C
–
.
4. Dimensions A and B do not include mould protrusion. Allowable
mould protrusion is 0.25mmper side. Dimensions A and B do
include mould msmatch and are determned at DatumPlane
–
H
–
.
5. Dimension D does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08 total in excess of the D dimension
at maximummaterial condition. Dambar cannot be located on the
lower radius or the foot.
6. Dimensions and tolerancing per ANSI Y 14.5M 1982.
7. All dimensions in mm
0.40 BSC
0
°
0.13
16.95
0.13
0
°
16.95
0.35
1.6 REF
7
°
0.30
17.45
—
—
17.45
0.45
0.80 BSC
—
0.13
0.65
12.00 REF
0.25
0.23
0.95
0
–
0
–
0
–
0.20 M C A
–
B S D S
F
Freescale Semiconductor, Inc.
n
.