
QPRO
TM
XQ4000E/EX QML High-Reliability Field Programmable Gate Arrays
2
May 19, 1998 (Version 2.1)
XQ4000E/EX Switching Characteristics
XQ4000E/EX Absolute Maximum Ratings
Note 1:
Maximum DC overshoot or undershoot above Vcc or below GND must be limited to either 0.5 V or 10 mA, whichever is
easier to achieve. During transitions, the device pins may undershoot to -2.0 V or overshoot to Vcc + 2.0 V, provided this
over- or undershoot lasts less than 20 ns.
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those listed under
Operating Conditions is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time may
affect device reliability.
Note 2:
XQ4000E/EX Recommended Operating Conditions
Note 1:
At case temperatures above those listed as Recommended Operating Conditions, all delay parameters increase by 0.35%
per
°
C.
Input and output Measurement thresholds are: 1.5V for TTL and 2.5V for CMOS.
All specifications are subject to change without notice.
Note 2:
Note 3:
Symbol
V
CC
V
IN
V
TS
T
STG
T
SOL
T
J
Description
Value
-0.5 to +7.0
-0.5 to V
CC
+0.5
-0.5 to V
CC
+0.5
-65 to +150
+260
+150
+125
Units
V
V
V
°
C
°
C
°
C
°
C
Supply voltage relative to GND
Input voltage relative to GND (Note 1)
Voltage applied to 3-state output (Note 1)
Storage temperature (ambient)
Maximum soldering temperature (10 s @ 1/16 in. = 1.5 mm)
Junction temperature
Ceramic packages
Plastic packages
Symbol
V
CC
V
CC
V
IH
V
IL
T
IN
Description
Min
4.5
4.5
2.0
0
Max
5.5
5.5
V
CC
0.8
250
Units
V
V
V
V
ns
Supply voltage relative to GND, T
C
= -55
°
C to +125
°
C
Supply voltage relative to GND, T
J
= -55
°
C to +125
°
C
High-level input voltage
Low-level input voltage
Input signal transition time
Ceramic packages
Plastic packages
TTL inputs
TTL inputs