
May 19, 1998 (Version 2.1)
15
XQ4000E IOB Output Switching Characteristic Guidelines
Testing of switching parameters is modeled after testing methods specified by MIL-M-38510/605. All devices are 100%
functionally tested. Internal timing parameters are derived from measuring internal test patterns. Listed below are
representative values. For more specific, more precise, and worst-case guaranteed data, use the values reported by the
static timing analyzer (TRCE in the Xilinx Development System) and back-annotated to the simulation netlist. These path
delays, provided as a guideline, have been extracted from the static timing analyzer report. All timing parameters assume
worst-case operating conditions (supply voltage and junction temperature). Values apply to all XQ4000E/EX devices unless
otherwise noted.
Note 1:
Output timing is measured at pin threshold, with 50pF external capacitive loads (incl. test fixture). Slew-rate limited output
rise/fall times are approximately two times longer than fast output rise/fall times. For the effect of capacitive loads on ground
bounce, see the “Additional XQ4000 Data” section of the Programmable Logic Data Book.
Voltage levels of unused pads, bonded or unbonded, must be valid logic levels. Each can be configured with the internal
pull-up (default) or pull-down resistor, or configured as a driven output, or can be driven from an external source.
Note 2:
Speed Grade
-3
-4
Units
Description
Symbol
Min
Max
Min
Max
Propagation Delays (TTL Output Levels)
Clock (OK) to Pad, fast
slew-rate limited
Output (O) to Pad, fast
slew-rate limited
3-state to Pad hi-Z
(slew-rate independent)
3-state to Pad active
and valid, fast
slew-rate limited
T
OKPOF
T
OKPOS
T
OPF
T
OPS
T
TSHZ
T
TSONF
T
TSONS
6.5
9.5
5.5
8.6
4.2
8.1
11.1
7.5
11.5
8.0
12.0
10.0
10.0
13.7
ns
ns
ns
ns
ns
ns
ns