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參數(shù)資料
| 型號(hào)： | UPD784031YGK-BE9 |
| 廠商： | NEC Corp. |
| 英文描述： | 16-/8-BIT SINGLE-CHIP MICROCONTROLLERS |
| 中文描述： | 16-/8-bit的單晶片微控制器 |
| 文件頁(yè)數(shù)： | 80/88頁(yè) |
| 文件大?。?/td> | 464K |
| 代理商： | UPD784031YGK-BE9 |
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80
μ
PD784031Y
15. RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the conditions recommended in the table below.
For details of recommended soldering conditions, refer to the information document
Semiconductor Device Mounting
Technology Manual (C10535E)
.
For soldering methods and conditions other than those recommended below, contact an NEC sales representative.
Table 15-1. Surface Mounting Type Soldering Conditions (1/2)
(1)
μ
PD784031YGC-3B9: 80-pin plastic QFP (14
×
14 mm, thickness 2.7 mm)
Soldering Method
Soldering Conditions
Symbol
Infrared reflow
Package peak temperature: 235
°
C, Duration: 30 sec. max. (at 210
°
C or above),
Number of times: 3 times max.
IR35-00-3
VPS
Package peak temperature: 215
°
C, Duration: 40 sec. max. (at 200
°
C or above),
Number of times: 3 times max.
VP15-00-3
Wave soldering
Solder bath temperature: 260
°
C max., Duration: 10 sec. max., Number of times: Once,
Preliminary heat temperature: 120
°
C max. (Package surface temperature)
WS60-00-1
Partial heating
Pin temperature: 300
°
C max. Duration: 3 sec. max. (per device side)
—
Caution
Use of more than one soldering method should be avoided (except in the case of partial heating).
(2)
μ
PD784031YGC-8BT: 80-pin plastic QFP (14
×
14 mm, thickness 1.4 mm)
Soldering Method
Soldering Conditions
Symbol
Infrared reflow
Package peak temperature: 235
°
C, Duration: 30 sec. max. (at 210
°
C or above),
Number of times: Twice max.
IR35-00-2
VPS
Package peak temperature: 215
°
C, Duration: 40 sec. max. (at 200
°
C or above),
Number of times: Twice max.
VP15-00-2
Wave soldering
Solder bath temperature: 260
°
C max., Duration: 10 sec. max., Number of times: Once,
Preliminary heat temperature: 120
°
C max. (Package surface temperature)
WS60-00-1
Partial heating
Pin temperature: 300
°
C max. Duration: 3 sec. max. (per device side)
—
Caution
Use of more than one soldering method should be avoided (except in the case of partial heating).
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