參數(shù)資料
型號: TSPC860XRVZQU66D
廠商: Atmel Corp.
英文描述: Integrated Communication Processor
中文描述: 綜合通信處理器
文件頁數(shù): 30/93頁
文件大?。?/td> 1601K
代理商: TSPC860XRVZQU66D
30
TSPC860 [Preliminary]
2129B–HIREL–12/04
Note:
1. Typical power dissipation is measured at 3.3V
2. Maximum power dissipation is measured at 3.5V
3. Values in Table 5 represent V
DDL
-based power dissipation and do not include I/O
power dissipation over V
DDH
. I/O power dissipation varies widely by application due to
buffer current, depending on external circuitry
Electrical Characteristics
General Requirements
All static and dynamic electrical characteristics specified for inspection purposes and the
relevant measurement conditions are given below.
DC Electrical
Specifications
Table 5.
Power Dissipation (P
D
)
(3)
Die Revision
Frequency
Typical
(1)
Maximum
(2)
Unit
D.4
(1:1 Mode)
50
656
735
mW
66
TBD
TBD
mW
D.4
(2:1 Mode)
66
722
762
mW
80
851
909
mW
Table 6.
DC Electrical Specification with V
CC
= 3.3 ± 5% V
DC
, GND = 0 V
DC
, -55
°
C
T
c
125
°
C
Characteristic
Symbol
Min
Max
Unit
Operating Voltage
V
DDH
,
V
DDL
,
KAPWR,
V
DDSYN
3.135
3.465
V
KAPWR
(power-down
mode)
2.0
3.6
V
KAPWR (all
other
operating
modes)
V
DDH
- 0.4
V
DDH
V
Input High Voltage (all inputs except EXTAL and EXTCLK)
V
IH
2.0
5.5
V
Input Low Voltage
V
IL
GND
0.8
V
EXTAL, EXTCLK Input High Voltage
V
IHC
0.7 × (V
DDH
)
V
DDH
+ 0.3
V
Input Leakage Current, V
IN
= 5.5V (Except TMS, TRST, DSCK and DSDI pins)
I
IN
-
100
μA
Input Leakage Current, V
IN
= 3.6V (Except TMS, TRST, DSCK and DSDI pins)
I
IN
-
10
μA
Input Leakage Current, V
IN
= 0V (Except TMS, TRST, DSCK and DSDI pins)
I
IN
-
10
μA
Output High Voltage, I
OH
= -2.0 mA, V
DDH
= 3.0V
Except XTAL, XFC, and Open drain pins
VOH
2.4
-
V
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