參數(shù)資料
型號： S71PL191HB0BFI100
廠商： SPANSION LLC
元件分類： 存儲器
英文描述： SPECIALTY MEMORY CIRCUIT, PBGA73
封裝： 9 X 13 MM, LEAD FREE, FBGA-73
文件頁數(shù)： 46/172頁
文件大?。?/td> 4662K
代理商： S71PL191HB0BFI100
16
S71PL191_193Hx0_00A2 May 7, 2004
Adva nce
Inform at i o n
Ordering Information
The order number (Valid Combination) is formed by the following:
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device.
Consult the local sales office to confirm availability of specific valid combinations and to
check on newly released combinations.
S71
P L
191
H B 0 B A W 00
0
PACKING TYPE)
0= Tray
2= 7” Tape & Reel
3
= 13” Tape & Reel
Additional ordering options
See Product Selector Guide
TEMPERATURE (and RELIABILITY) GRADE
E
= Engineering Samples
W
= Wireless (-25
°C to +85°C)
I= Industrial (-40
°C to +85°C)
PACKAGE MATERIAL SET (BGA Package Type)
A
= Standard (not Pb-free) Package
F
= Lead (Pb)-free Package
PACKAGE TYPE
B= BGA Package
CHIP CONTENTS—2
0
= No second content
CHIP CONTENTS—1
B
= 32 Mb
C
= 64 Mb
Spansion FLASH MEMORY PROCESS TECHNOLOGY
(Highest-density Flash described in Characters 4-8)
H
= 130 nm Floating Gate Technology
BASE NOR FLASH DENSITY
191
= 127 + 64
193
= 129 + 64
BASE NOR FLASH CORE VOLTAGE
L= 3-volt VCC
BASE NOR FLASH INTERFACE and SIMULTANEOUS READ/
WRITE
P
= Page Mode, Simultaneous Read/Write
PRODUCT SERIES
71
= Base Flash + xRAM. Character 10: xRAM density. Character 11:0.
PREFIX
S= Spansion
Valid Combinations
Flash
Access
Time (ns)
pSRAM
Access
Time (ns)
Temperature
Range
Materials
Supplier
Order Number
Package Marking
S71PL191HB0BAI10
71PL191HB0BAI10
70
-40 - +85°C
Pb-free compliant
Supplier 2
S71PL191HB0BAW10
71PL191HB0BAW10
70
-25 - +85°C
Pb-free compliant
Supplier 2
S71PL191HB0BFI10
71PL191HB0BFI10
70
-40 - +85°C
Pb-free
Supplier 2
S71PL191HB0BFW10
71PL191HB0BFW10
70
-25 - +85°C
Pb-free
Supplier 2
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