參數(shù)資料
型號： PXA270
廠商： Intel Corp.
英文描述： Electrical, Mechanical, and Thermal Specification
中文描述： 電氣，機械和熱規(guī)格
文件頁數(shù)： 19/126頁
文件大?。?/td> 1563K
代理商： PXA270
Electrical, Mechanical, and Thermal Specification
3-7
Intel PXA270 Processor
Package Information
3.3
Junction To Case Temperature Thermal Resistance
3.4
Processor Markings
The diagram in this section details the processor’s top markings, which identify the PXA270
processor in the 356-ball VF-BGA and 360-ball PBGA package. Refer to
Figure 3-4
for product
information. A Pb-Free (lead-free) package is indicated by the letter “E” on the 3rd line of
information (Intel legal line). The “E” appears after the date stamp.
Table 3-1. Processor Material Properties
Component
VF-BGA Material
PBGA Material
Mold compound
ShinEtsu KMC 2500 VAT1
Sumitomo G770LE
Solder balls
63 Sn/37 Pb
63 Sn/37 Pb
Subsequent processor steppings may use
Pb-free (94.5 Sn/5.0 Ag/ 0.5 Cu) balls
.
Parameter
VF-BGA Value and Units
PBGA Value and Units
Theta Jc
2 degrees C / watt
1.4 degrees C / watt
Figure 3-10. Intel PXA270 Processor Production Markings, (Laser Mark on Top Side)
g
Laser Mark on top side of Package
Product
Lot #
Intel Legal
i
FPO#
M C ‘03
TAIWAN
PIN 1 INDICATOR
COO
PXA270C0C416
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