- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄370028 > PXA270 (Intel Corp.) Electrical, Mechanical, and Thermal Specification PDF資料下載
參數(shù)資料
| 型號： | PXA270 |
| 廠商： | Intel Corp. |
| 英文描述： | Electrical, Mechanical, and Thermal Specification |
| 中文描述： | 電氣，機械和熱規(guī)格 |
| 文件頁數(shù)： | 111/126頁 |
| 文件大?。?/td> | 1563K |
| 代理商： | PXA270 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁第76頁第77頁第78頁第79頁第80頁第81頁第82頁第83頁第84頁第85頁第86頁第87頁第88頁第89頁第90頁第91頁第92頁第93頁第94頁第95頁第96頁第97頁第98頁第99頁第100頁第101頁第102頁第103頁第104頁第105頁第106頁第107頁第108頁第109頁第110頁當(dāng)前第111頁第112頁第113頁第114頁第115頁第116頁第117頁第118頁第119頁第120頁第121頁第122頁第123頁第124頁第125頁第126頁
Electrical, Mechanical, and Thermal Specification
Glossary-1
Glossary
A
3G:
An industry term used to describe the next, still-to-come generation of wireless applications. It represents a
move from circuit-switched communications (where a device user has to dial in to a network) to broadband,
high-speed, packet-based wireless networks (which are always on). The first generation of wireless
communications relied on analog technology, followed by digital wireless communications. The third generation
expands the digital capabilities by including high-speed connections and increased reliability.
802.11:
Wireless specifications developed by the IEEE, outlining the means to manage packet traffic over a
network and ensure that packets do not collide, which could result in the loss of data, when travelling from device
to device.
8PSK:
8 phase shift key modulation scheme. Used in the EDGE standard.
AC ’97
AC-link standard serial interface for modem and audio
ACK:
Handshake packet indicating a positive acknowledgment.
Active device:
A device that is powered and is not in the suspended state.
Air interface:
the RF interface between a mobile cellular handset and the base station
AMPS:
Advanced Mobile Phone Service. A term used for analog technologies, the first generation of wireless
technologies.
Analog:
Radio signals that are converted into a format that allows them to carry data. Cellular phones and other
wireless devices use analog in geographic areas with insufficient digital networks.
ARM* V5te:
An ARM* architecture designation indicating the processor is conforms to ARM* architecture
version 5, including “Thumb” mode and the “El Segundo” DSP extensions.
Asynchronous Data:
Data transferred at irregular intervals with relaxed latency requirements.
Asynchronous RA:
The incoming data rate, Fs i, and the outgoing data rate, Fs o, of the RA process are
independent (i.e., there is no shared master clock). See also
rate adaptation
.
Asynchronous SRC:
The incoming sample rate, Fsi, and outgoing sample rate, Fso, of the SRC process are
independent (i.e., there is no shared master clock). See also sample
rate conversion
.
Audio device:
A device that sources or sinks sampled analog data.
AWG#:
The measurement of a wire’s cross-section, as defined by the American Wire Gauge standard.
Babble:
Unexpected bus activity that persists beyond a specified point in a (micro)frame.
Backlight Inverter:
A device to drive cold cathode fluorescent lamps used to illuminate LCD panels.
Bandwidth:
The amount of data transmitted per unit of time, typically bits per second (b/s) or bytes per second
(B/s). The size of a network “pipe” or channel for communications in wired networks. In wireless, it refers to the
range of available frequencies that carry a signal.
Base Station
:The telephone company’s interface to the Mobile Station
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| PXAC37 | XA 16-bit microcontroller family 32K/1024 OTP CAN transport layer controller 1 UART, 1 SPI Port, CAN 2.0B, 32 CAN ID Filters, transport layer co-proce |
| PXB16050U | NPN microwave power transistor |
| PY08-02 | INDUSTRIERELAIS FASSUNG PCB |
| PY08-02186697 | SOCKET PCB |
| PY14 | INDUSTRIERELAIS CHASSIS MONTAGESOCKEL |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PXA300 | 制造商:Marvell 功能描述: |
| PXA310 | 制造商:MARVELL 制造商全稱:MARVELL 功能描述:Rich Multimedia with Scalable Performance up to 624 MHz for Cost-Effective and Power-Effi cient Secure 3.5G Smartphones |
| PXA320 | 制造商:MARVELL 制造商全稱:MARVELL 功能描述:Cost-Effective, Scalable Performance up to 806 MHz for Power-Efficient, High-End Multimedia Handsets, Embedded Solutions, and Enterprise-Class Devices |
| PXA6.3VC101MF60TP | 功能描述:鋁有機聚合物電容器 100UF 6.3V SMT CAN RoHS:否 制造商:Panasonic Electronic Components 電容:470 uF 容差:20 % 電壓額定值:2.5 V ESR:4.5 mOhms 工作溫度范圍:- 40 C to + 105 C 端接類型:SMD/SMT 外殼直徑: 外殼長度:7.3 mm 外殼寬度:4.3 mm 外殼高度:1.9 mm 封裝:Reel |
| PXA6.3VC471MH12TP | 制造商:United Chemi-Con Inc 功能描述:Cap Aluminum 470uF 6.3V 20% (8 X 12mm) SMD 0.012 Ohm 4770mA 2000 hr 105°C T/R |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。