參數(shù)資料
型號(hào)： PPC405EZ-CSAfffTx
廠商： Applied Micro Circuits Corp.
英文描述： PowerPC 405EZ Embedded Processor
中文描述： 嵌入式處理器的PowerPC 405EZ
文件頁(yè)數(shù)： 42/54頁(yè)
文件大?。?/td> 362K
代理商： PPC405EZ-CSAFFFTX
PPC405EZ – PowerPC 405EZ Embedded Processor
42
AMCC Proprietary
Revision 1.27 - August 22, 2007
Preliminary Data Sheet
Thermal Management
The following heat sink was used in the above thermal analysis:
Aavid Thermalloy, PN 79985
The heat sink is manufactured by:
Aavid Thermalloy
70 Commercial St.
Concord, NH 03301
USA
Tel: (603)224-9988
URL:
www.aavidthermalloy.com
Table 8. Package Thermal Specifications
The PPC405EZ is designed to operate within a case temperature range of -40°C to +105°C. Thermal resistance values for the
EPBGA packages in a convection environment are as follows:
Parameter
Symbol
Airflow
ft/min (m/sec)
200 (1.02)
Unit
0 (0)
100 (0.51)
300 (1.52)
400 (2.02)
600 (3.03)
Junction-to-ambient thermal resistance
without
heat sink
Junction-to-ambient thermal resistance
with
heat sink
θ
JA
29.3
24.1
22.9
22.4
22.0
21.6
°C/W
θ
JA
22.7
14.3
12.3
11.5
11.1
10.7
°C/W
Resistance Value
Junction-to-case thermal resistance
θ
JC
θ
JB
11.9
°C/W
Junction-to-board thermal resistance
16.4
°C/W
Notes:
1. Values in the table are achieved with the following JEDEC standard board: 114.5mm x 101.6mm x 1.6mm, 4 layers.
2. For a chip mounted on a card with at least one signal and two power planes, the following relationships exist:
a. Case temperature, T
C
, is measured at top center of case surface with device soldered to circuit board.
b. T
A
= T
C
– Px
θ
CA
, where T
A
is ambient temperature and P is power consumption.
c. T
CMax
= T
JMax
– Px
θ
JC
, where T
JMax
is maximum junction temperature and P is power consumption.
3. Values with a heat sink were achieved with a 38.1mm x 38.1mm x 16.5mm unit, attached to the chip using a 0.1mm thickness of
adhesive having a thermal conductivity of 1.3W/mK.
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