參數資料
型號: pentium II cpu with mobile
廠商: Intel Corp.
英文描述: pentium II processor With On-die Cache Mobile Module Connector 2 (MMC-2)(帶緩存和連接器2的奔II處理器)
中文描述: 奔騰II處理器芯片上緩存手機模塊連接器2(絲裂霉素2)(帶緩存和連接器2的奔二處理器)
文件頁數: 43/48頁
文件大?。?/td> 537K
代理商: PENTIUM II CPU WITH MOBILE
Intel
a
Pentium
a
II Processor With On-Die Cache Mobile Module MMC-2
43
millimeter screws should be 2.25-millimeter gageable thread
(2.25-millimeters minimum to 2.80-millimeters maximum).
The system manufacturer should use the exact dimensions
for maximum contact area to the TTP to ensure that no
warpage of the TTP occurs. If warpage occurs, the thermal
resistance of the module could be adversely affected.
The TTP thermal resistance between the processor core to
the system interface (top of the TTP) is less than 1 Celsius
per watt.
Figure 14. Thermal Transfer Plate (A)
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