參數(shù)資料
型號(hào)： pentium II cpu with mobile
廠商： Intel Corp.
英文描述： pentium II processor With On-die Cache Mobile Module Connector 2 (MMC-2)(帶緩存和連接器2的奔II處理器)
中文描述： 奔騰II處理器芯片上緩存手機(jī)模塊連接器2（絲裂霉素2）（帶緩存和連接器2的奔二處理器）
文件頁(yè)數(shù)： 3/48頁(yè)
文件大?。?/td> 537K
代理商： PENTIUM II CPU WITH MOBILE
Intel
a
Pentium
a
II Processor With On-Die Cache Mobile Module MMC-2
3
CONTENTS
1.0
1.1
2.0
3.0
3.1
3.1.1
3.1.2
3.1.3
3.1.4
3.1.5
3.1.6
3.1.7
3.1.8
3.1.9
3.1.10
3.1.11
3.2
3.3
4.0
4.1
INTRODUCTION ..................................................5
Revision History....................................................5
ARCHITECTURE OVERVIEW.............................5
CONNECTOR INTERFACE.................................7
Signal Definitions ..................................................7
Signal List.....................................................8
Memory (109 Signals)..................................9
AGP (60 Signals).......................................10
PCI (58 Signals).........................................11
Geyserville (4 Signals)...............................12
Processor/PIIX4E/M Sideband (8 Signals)13
Power Management (7 Signals)................14
Clock (9 Signals)........................................15
Voltages (54 Signals).................................16
ITP/JTAG (9 Signals).................................17
Miscellaneous (82 Signals)........................17
Connector Pin Assignments...............................18
Pin and Pad Assignments...................................21
FUNCTIONAL DESCRIPTION...........................22
Pentium II Processor With On-Die Cache Mobile
Module MMC-2......................................................22
L2 Cache.............................................................22
The 82433BX Host Bridge System Controller....22
Memory Organization ................................22
Reset Strap Options ..................................23
PCI Interface..............................................23
AGP Interface.............................................23
Power Management............................................23
Clock Control Architecture.........................23
Normal State..............................................25
Auto Halt State...........................................25
Stop Grant State........................................25
Quick Start State........................................25
HALT/Grant Snoop State...........................25
Sleep State.................................................25
4.2
4.3
4.3.1
4.3.2
4.3.3
4.3.4
4.4
4.4.1
4.4.2
4.4.3
4.4.4
4.4.5
4.4.6
4.4.7
4.4.8
4.5
4.6
4.6.1
4.6.2
Deep Sleep State...................................... 26
Typical POS/STR Power.................................... 26
Electrical Requirements..................................... 27
DC Requirements...................................... 27
AC Requirements...................................... 28
4.6.2.1
PSB Clock Signal Quality Specifications
and Measurement Guidelines.............. 29
Voltage Regulator............................................... 29
Voltage Regulator Efficiency..................... 29
Control of the Voltage Regulator.............. 30
4.7.2.1
Voltage Signal Definition and
Sequencing........................................... 31
4.7.3 Power Planes: Bulk Capacitance Requirements... 32
4.7.4
Surge Current Guidelines ......................... 34
4.7.4.1
Slew-rate Control: Circuit Description.. 36
4.7.4.2
Undervoltage Lockout: Circuit
Description (V_uv_lockout).................. 37
4.7.4.3
Overvoltage Lockout: Circuit Description
(V_ov_lockout)...................................... 37
4.7.4.4
Overcurrent Protection: Circuit
Description............................................ 38
4.8
Active Thermal Feedback .................................. 39
4.9
Thermal Sensor Configuration Register............ 39
5.0
MECHANICAL SPECIFICATION....................... 39
5.1
Module Dimensions............................................ 39
5.1.2
Pin 1 Location of the MMC-2 Connector.. 41
5.1.3
Printed Circuit Board Thickness ............... 41
5.1.4
Height Restrictions.................................... 42
5.2
Thermal Transfer Plate....................................... 42
5.3
Module Physical Support ................................... 44
5.3.1
Module Mounting Requirements............... 44
5.3.2
Module Weight .......................................... 45
6.0
THERMAL SPECIFICATION............................. 45
6.1
Thermal Design Power....................................... 45
6.2
Thermal Sensor Setpoint ................................... 45
7.0
LABELING INFORMATION............................... 46
8.0
ENVIRONMENTAL STANDARDS..................... 47
4.7
4.7.1
4.7.2
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