參數(shù)資料
型號(hào)： pentium II cpu with mobile
廠商： Intel Corp.
英文描述： pentium II processor With On-die Cache Mobile Module Connector 2 (MMC-2)(帶緩存和連接器2的奔II處理器)
中文描述： 奔騰II處理器芯片上緩存手機(jī)模塊連接器2（絲裂霉素2）（帶緩存和連接器2的奔二處理器）
文件頁(yè)數(shù)： 42/48頁(yè)
文件大?。?/td> 537K
代理商： PENTIUM II CPU WITH MOBILE
Intel
a
Pentium
a
II Processor With On-Die Cache Mobile Module MMC-2
42
5.1.4
Height Restrictions
Figure 13 shows the mechanical stack-up and associated
component clearance requirements. This is the module
keep-out zone and should not be entered. The system
manufacturer establishes board-to-board clearance between
the module and the system electronics by selecting one of
three mating connectors. The connector sizes available are
4 millimeters, 6 millimeters, and 8 millimeters. The three
sizes provide flexibility in choosing the system electronics
components between the two boards. Information on these
connectors can be obtained from your local Intel
representative.
NOTE:
The topside component clearance is independent of the PCB thickness.
Figure 13. Keep-out Zone
5.2
Thermal Transfer Plate
The TTP on the CPU and the 82433BX provides heat
dissipation and a thermal attach point where a system
manufacturer can attach a heat pipe, a heat spreader plate,
or a thermal solution to transfer heat through the notebook
system. See Figure 14 and Figure 15 for attachment
dimensions from the thermal interface block to the TTP.
When attaching the mating block to the TTP, a thermal
elastimer or thermal grease should be used. This material
reduces the thermal resistance. The thermal interface block
should be secured with 2.0-millimeter screws using a
maximum torque of 1.5 Kg*cm to 2.0 Kg*cm (equivalent to
0.147 N*m to.197 N*m). The thread length of the 2.00-
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