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| 型號(hào)： | NS32FX16-20 |
| 廠商： | National Semiconductor Corporation |
| 英文描述： | Imaging/Signal Processor |
| 中文描述： | 影像/信號(hào)處理器 |
| 文件頁數(shù)： | 60/88頁 |
| 文件大小： | 902K |
| 代理商： | NS32FX16-20 |
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4.0 Device Specifications
(Continued)
4.2 ABSOLUTE MAXIMUM RATINGS
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.
Temperature under Bias
0
§
C to
a
70
§
C
b
65
§
C to
a
150
§
C
Storage Temperature
All Input or Output Voltages
with Respect to GND
b
0.5V to
a
7V
Note: Absolute maximum ratings indicate limits beyond
which permanent damage may occur. Continuous operation
at these limits is not intended; operation should be limited to
those conditions specified under Electrical Characteristics.
4.3 ELECTRICAL CHARACTERISTICS
T
A
e
0
§
C to
a
70
§
C, V
CC
e
5V
g
10%, GND
e
0V
Symbol
Parameter
Conditions
Min
Typ
Max
Units
V
IH
High Level Input Voltage
2.0
V
CC
a
0.5
V
V
IL
Low Level Input Voltage
b
0.5
0.8
V
V
T
a
RSTI Rising Threshold Voltage
V
CC
e
5.0V
2.5
3.5
V
V
XL
OSCIN Input Low Voltage
0.5
V
V
XH
OSCIN Input High Voltage
4.5
V
V
OH
High Level Output Voltage
I
OH
e b
400
m
A
2.4
V
V
OL
Low Level Output Voltage
I
OL
e
4 mA
0.45
V
I
ILS
SPC Input Current (Low)
V
IN
e
0.4V, SPC in Input Mode
1.0
mA
I
I
Input Load Current
0
s
V
IN
s
V
CC
,
All Inputs except SPC
b
20
20
m
A
I
L
Leakage Current
Output and I/O Pins in
TRI-STATE or Input Mode
0.4
s
V
OUT
s
V
CC
b
20
20
m
A
I
CC
Active Supply Current
I
OUT
e
0, T
A
e
25
§
C
(Note 2)
170
240
mA
Note 1:
Care should be taken by designers to provide a minimum inductance path between the GND pins and system ground in order to minimize noise.
Note 2:
I
CC
is affected by the clock scaling factor selected by the C- and M-bits in the CFG register, see Section 3.5.3.
4.4 SWITCHING CHARACTERISTICS
4.4.1 Definitions
All the timing specifications given in this section refer to
0.8V or 2.0V on the rising or falling edges of all the signals
as illustrated in Figures 4-2 and 4-3 unless specifically stat-
ed otherwise. The capacitive load is assumed to be 100 pF
on CTTL and 50 pF on all the other output signals.
TL/EE/10818–40
FIGURE 4-2. Output Signals Specification Standard
Abbreviations:
L.E.D Leading Edge
T.E.D Traling Edge
R.E.D Rising Edge
F.E.D Falling Edge
TL/EE/10818–41
FIGURE 4-3. Input Signals Specification Standard
60
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| NS32FX16-25 | Imaging/Signal Processor |
| NS32FX164-20 | Advanced Imaging/Communication Signal Processors(高級(jí)圖象/通訊信號(hào)處理器) |
| NS32FV16-25 | Advanced Imaging/Communication Signal Processors |
| NS32FX164-25 | Advanced Imaging/Communication Signal Processors(高級(jí)圖象/通訊信號(hào)處理器) |
| NS32FX161-15 | Advanced Imaging/Communication Signal Processors(高級(jí)圖象/通訊信號(hào)處理器) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| NS32FX16-25 | 制造商:NSC 制造商全稱:National Semiconductor 功能描述:Imaging/Signal Processor |
| NS32FX164 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述: |
| NS32FX164-20 | 制造商:NSC 制造商全稱:National Semiconductor 功能描述:Advanced Imaging/Communication Signal Processors |
| NS32FX164-25 | 制造商:NSC 制造商全稱:National Semiconductor 功能描述:Advanced Imaging/Communication Signal Processors |
| NS32FX164AV-25 | 功能描述:IC IMAGING COMM SGNL PROC PLCC68 RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:- 標(biāo)準(zhǔn)包裝:2 系列:MPC8xx 處理器類型:32-位 MPC8xx PowerQUICC 特點(diǎn):- 速度:133MHz 電壓:3.3V 安裝類型:表面貼裝 封裝/外殼:357-BBGA 供應(yīng)商設(shè)備封裝:357-PBGA（25x25） 包裝:托盤 |
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