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參數(shù)資料
| 型號： | NS32FX16-20 |
| 廠商： | National Semiconductor Corporation |
| 英文描述： | Imaging/Signal Processor |
| 中文描述： | 影像/信號處理器 |
| 文件頁數(shù)： | 40/88頁 |
| 文件大?。?/td> | 902K |
| 代理商： | NS32FX16-20 |
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3.0 Functional Description
(Continued)
TABLE 3-4. Circular Buffer Sizes
DS
Field
External
Buffer
Size (DW)
Constant
Address
bits
Incremented
Address
bits
00
01
10
11
8
A0, A5–A23
A0, A6–A23
A0, A7–A23
A0, A8–A23
A1–A4
A1–A5
A1–A6
A1–A7
16
32
64
3.5 SYSTEM INTERFACE
This section provides general information on the NS32FX16
interface to the external world. Descriptions of the CPU re-
quirements as well as the various bus characteristics are
provided here. Details on other device characteristics in-
cluding timing are given in Chapter 4.
3.5.1 Power and Grounding
The NS32FX16 requires a single 5V power supply, applied
on the V
CC
pins. These pins should be connected together
by a power (V
CC
) plane on the printed circuit board.
The grounding connections are made on the GND pins.
These pins should be connected together by a ground
(GND) plane on the printed circuit board.
Both power and ground connections are shown in Figure
3-14.
For optimal noise immunity, the power and ground pins
should be connected to V
CC
and ground planes respective-
ly. If V
CC
and ground planes are not used, single conductors
should be run directly from each V
CC
pin to a power point,
and from each GND pin to a ground point. Daisy-chained
connections should be avoided.
Decoupling capacitors should also be used to keep the
noise level to a minimum. Standard 0.1
m
F ceramic capaci-
tors can be used for this purpose. They should attach to
V
CC
, GND pins as close as possible to the NS32FX16.
During prototype using wire-wrap or similar methods, the
capacitors should be soldered directly to the power pins of
the NS32FX16 socket, or as close as possible, with very
short leads.
Design Notes
When constructing a board using high frequency clocks with
multiple lines switching, special care should be taken to
avoid resonances on signal lines. A separate power and
ground layer is recommended. This is true when designing
boards for the NS32FX16. Switching times of under 5 ns on
some lines are possible. Resonant frequencies should be
maintained well above the 200 MHz frequency range on
signal paths by keeping traces short and inductance low.
Loading capacitance at the end of a transmission line con-
tributes to the resonant frequency and should be minimized
if possible. Capacitors should be located as close as possi-
ble across each power and ground pair near the NS32FX16.
Power and ground connections are shown in Figure 3-14.
3.5.2 Clocking
The NS32FX16 provides an internal oscillator that interacts
with
an
external
clock
source
OSCIN and OSCOUT.
through
two
signals;
TL/EE/10818–22
FIGURE 3-14. Power and Ground Connections
Either an external single-phase clock signal or a crystal can
be used as the clock source. If a single-phase clock source
is used, only the connection on OSCIN is required; OSC-
OUT should be left unconnected or loaded with no more
than 5 pF of stray capacitance. The voltage level require-
ments specified in Section 4.3 must also be met for proper
operation.
When operation with a crystal is desired, special care
should be taken to minimize stray capacitances and induc-
tances. The crystal, as well as the external components,
should be placed in close proximity to the OSCIN and
OSCOUT pins to keep the printed circuit trace lengths to an
absolute minimum. Figure 3-15 and 3-16 show the external
crystal interconnections. Table 3-5 provides the crystal
characteristics and the values of the R, C, and L compo-
nents, including stray capacitance, required for various fre-
quencies.
TL/EE/10818–23
FIGURE 3-15. Crystal InterconnectionsD30 MHz
TL/EE/10818–24
FIGURE 3-16. Crystal Interconnections,
40 MHz, 50 MHz
40
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PDF描述 |
|---|---|
| NS32FX16-25 | Imaging/Signal Processor |
| NS32FX164-20 | Advanced Imaging/Communication Signal Processors(高級圖象/通訊信號處理器) |
| NS32FV16-25 | Advanced Imaging/Communication Signal Processors |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| NS32FX16-25 | 制造商:NSC 制造商全稱:National Semiconductor 功能描述:Imaging/Signal Processor |
| NS32FX164 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述: |
| NS32FX164-20 | 制造商:NSC 制造商全稱:National Semiconductor 功能描述:Advanced Imaging/Communication Signal Processors |
| NS32FX164-25 | 制造商:NSC 制造商全稱:National Semiconductor 功能描述:Advanced Imaging/Communication Signal Processors |
| NS32FX164AV-25 | 功能描述:IC IMAGING COMM SGNL PROC PLCC68 RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:- 標準包裝:2 系列:MPC8xx 處理器類型:32-位 MPC8xx PowerQUICC 特點:- 速度:133MHz 電壓:3.3V 安裝類型:表面貼裝 封裝/外殼:357-BBGA 供應(yīng)商設(shè)備封裝:357-PBGA（25x25） 包裝:托盤 |
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