- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄369923 > MPC107 (Motorola, Inc.) 32-Bit Microprocessor(32位微處理器) PDF資料下載
參數(shù)資料
| 型號： | MPC107 |
| 廠商： | Motorola, Inc. |
| 英文描述： | 32-Bit Microprocessor(32位微處理器) |
| 中文描述： | 32位微處理器（32位微處理器） |
| 文件頁數(shù)： | 13/46頁 |
| 文件大小： | 585K |
| 代理商： | MPC107 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁當(dāng)前第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁
MPC107 Hardware Specifications (Rev 0.2)
PRELIMINARYSUBJECT TO CHANGE WITHOUT NOTICE
13
Electrical and Thermal Characteristics
1.4.2 Thermal Characteristics
Table 6 provides the package thermal characteristics for the MPC107.
1.4.3 AC Electrical Characteristics
This section provides the AC electrical characteristics for the MPC107. After fabrication, functional parts
are sorted by maximum core frequency as shown in Table 7 and Section 1.4.3.1, òClock AC SpeciTcationsó
and tested for conformance to the AC speciTcations for that frequency. The core frequency is determined by
the bus (PCI_SYNC_IN) clock frequency and the settings of the PLL_CFG[0D3] signals. Parts are sold by
maximum processor core frequency; see Section 1.9, òOrdering Informationó.
Table 7 provides the operating frequency information for the MPC107.
Table 6. PBGA Package Thermal Characteristics
Characteristic
Symbols
Value
Units
Die Junction-to-Case Thermal Resistance
q
JC
< 0.1
C/W
Die Junction-to-Board Thermal Resistance
q
JB
5.2
C/W
Package Junction-to-Ambient Thermal Resistance
2
q
JA
See Figure 25
Notes:
1. Refer to Section 1.7, òSystem Design Informationó for more details about thermal
management
.
2. T
J
= T
A
+ P
D
x
q
JA
T
J
= Die junction temperature.
T
A
= System air ambient temperature near the package.
P
D
= Average power consumed by IC in Watts.
q
JA
= Thermal resistance from die junction to ambient air in C/W
Table 7. Operating Frequency
At recommended operating conditions (See Table 2) with GVdd = 3.3 V ± 5% and LVdd = 3.3 V ± 5%
Characteristic
1
66 MHz
100 MHz
Units
Min
Max
Min
Max
Core (memory bus/processor bus) frequency
25
66
25
100
MHz
PCI input frequency (PCI_SYNC_IN)
12.5D66
MHz
Notes:
Caution: The PCI_SYNC_IN frequency and PLL_CFG[0D3] settings must be chosen such that the resulting
peripheral logic/ memory bus frequency, CPU (core) frequency, and PLL (VCO) frequencies do not exceed
their respective maximum or minimum operating frequencies. Refer to the PLL_CFG[0D3] signal description
in Section 1.6, òPLL ConTgurationó for valid PLL_CFG[0D3] settings and PCI_SYNC_IN frequencies.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MPC505 | Highly Integrated, Low-Power, 32-Bit Microcontroller |
| MPC509 | Highly Integrated, Low-Power, 32-Bit Microcontroller |
| MPC5200BV400 | MPC5200 Hardware Specifications |
| MPC5200CBV266 | MPC5200 Hardware Specifications |
| MPC5200CBV400 | MPC5200 Hardware Specifications |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPC-108 | 制造商:Greenlee Textron Inc 功能描述:Unspecified Tools & Accessories ADAPTER,MATING BULKHEAD |
| MPC108100J | 功能描述:厚膜電阻器 - 透孔 MPC10 10R 5% RoHS:否 制造商:Caddock 電阻:27 kOhms 容差:1 % 功率額定值:8 W 溫度系數(shù):50 PPM / C 系列:MS 端接類型:Axial 電壓額定值:2 kV 工作溫度范圍:- 15 C to + 275 C 尺寸:8.89 mm Dia. x 23.11 mm L 封裝:Bulk |
| MPC108101J | 制造商:TE Connectivity 功能描述:RESISTOR 10 WATT 100R 5% |
| MPC108102J | 功能描述:厚膜電阻器 - 透孔 MPC10 1K0 5% RoHS:否 制造商:Caddock 電阻:27 kOhms 容差:1 % 功率額定值:8 W 溫度系數(shù):50 PPM / C 系列:MS 端接類型:Axial 電壓額定值:2 kV 工作溫度范圍:- 15 C to + 275 C 尺寸:8.89 mm Dia. x 23.11 mm L 封裝:Bulk |
| MPC108103J | 功能描述:厚膜電阻器 - 透孔 MPC10 10K 5% RoHS:否 制造商:Caddock 電阻:27 kOhms 容差:1 % 功率額定值:8 W 溫度系數(shù):50 PPM / C 系列:MS 端接類型:Axial 電壓額定值:2 kV 工作溫度范圍:- 15 C to + 275 C 尺寸:8.89 mm Dia. x 23.11 mm L 封裝:Bulk |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。