參數(shù)資料
型號: K4J52324KI-HC1A0
元件分類: DRAM
英文描述: 512M X 1 DDR DRAM, 0.2 ns, PBGA136
封裝: HALOGEN FREE AND ROHS COMPLIANT, FBGA-136
文件頁數(shù): 22/61頁
文件大?。?/td> 1364K
代理商: K4J52324KI-HC1A0
- 29 -
K4J52324KI
datasheet
GDDR3 SGRAM
Rev. 1.2
7.9.2 READs
READ bursts are initiated with a READ command, as below figure. The starting column and bank addresses
are provided with the READ command and auto precharge is either enabled or disabled for that burst access.
If auto precharge is enabled, the row being accessed is precharged at the completion of the burst after
tRAS(min) has been met. For the generic READ commands used in the following illustrations, auto precharge
is disabled.
During READ bursts, the valid data-out element from the starting column address will be available following
the CAS Latency after the READ command. Each subsequent data-out element will be valid nominally at the
next positive or negative strobe edge. READ burst figure shows general timing for 2 of the possible CAS
latency settings. The GDDR3(x32) drives the output data edge aligned to the crossing of CK and /CK and to
RDQS. The initial HIGH transition LOW of RDQS is known as the read preamble; the half cycle coincident
with the last data-out element is known as the read postamble.
Upon completion of a burst, assuming no other commands have been initiated, the DQs will go High-Z. A
detailed explanation of tDQSQ (valid data-out skew), tDV (data-out window hold), the valid data window are
depicted in Data Output Timing (1) figure. A detailed explanation of tAC (DQS and DQ transition skew to CK)
is shown in Data Output Timing (2) figure.
Data from any READ burst may be concatenated with data from a subsequent READ command. A continu-
ous flow of data can be maintained. The first data element from the new burst follows the last element of a
completed burst. The new READ command should be issued x cycles after the first READ command, where
x equals the number of data element nibbles (nibbles are required by the 4n-prefetch architecture) depending
on the burst length. This is shown in consecutive READ bursts figure. Nonconsecutive read data is shown for
illustration in nonconsecutive READ bursts figure. Full-speed random read accesses within a page (or pages)
can be performed as shown in Random READ accesses figure. Data from a READ burst cannot be termi-
nated or truncated.
During READ commands the GDDR3 DRAM disables its data terminators.
CK
CA
EN AP
DIS AP
BA
CS
RAS
CAS
WE
A0-A7, A9
A10, A11
A8
BA0,1,2
CA = Column Address
BA = Bank Address
EN AP = Enable Auto Precharge
DIS AP = Disable Auto Precharge
CKE
HIGH
READ Command
DON’T CARE
相關(guān)PDF資料
PDF描述
K4M64163PK-BE900 4M X 16 SYNCHRONOUS DRAM, 7 ns, PBGA54
K507 2 ELEMENT, 2000 uH, GENERAL PURPOSE INDUCTOR
K001 2 ELEMENT, 2000 uH, GENERAL PURPOSE INDUCTOR
K004 2 ELEMENT, 500 uH, GENERAL PURPOSE INDUCTOR
K5A22NAU KEYPAD SWITCH, SPST, MOMENTARY, 0.1A, 50VDC, 2 N, SURFACE MOUNT-STRAIGHT
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
K4J52324QC 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:512Mbit GDDR3 SDRAM
K4J52324QC-AC20000 制造商:Samsung Semiconductor 功能描述:GDDR3 SDRAM X32 BOC - Trays
K4J52324QC-BC14 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:512Mbit GDDR3 SDRAM
K4J52324QC-BC14000 制造商:Samsung Semiconductor 功能描述:GDDR3 SDRAM X32 BOC LEAD PART 10W - Trays
K4J52324QC-BC16 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:512Mbit GDDR3 SDRAM