參數(shù)資料
型號(hào)： intel Pentium II processor
廠商： Intel Corp.
英文描述： Pentium II Processor Mobile Module(帶移動(dòng)模塊奔II處理器)
中文描述： 奔騰II處理器的移動(dòng)模塊（帶移動(dòng)模塊奔二處理器）
文件頁(yè)數(shù)： 4/46頁(yè)
文件大小： 681K
代理商： INTEL PENTIUM II PROCESSOR
4
INTEL
PENTIUM
II PROCESSOR MOBILE MODULE MMC-1
FIGURES
Figure 1. Block Diagram of the Pentium
II Processor
Mobile Module .........................................................6
Figure 2. 280-Pin Connector Footprint Pad Numbers,
Module Secondary Side.........................................18
Figure 3. Pentium
II Processor Mobile Module Clock
Control States .......................................................22
Figure 4. BCLK, TCK, PICCLK Generic Clock Waveform
at the Processor Core Pin .....................................27
Figure 5. Power-On Sequence Timing.................................30
Figure 6. Instantaneous In-Rush Current Model..................31
Figure 7. Instantaneous In-Rush Current.............................32
Figure 8. Over-Current Protection Circuit.............................33
Figure 9. Spice Simulation Using In-Rush Protection
(Example Only).....................................................34
Figure 10. Pentium
II Processor MMC-1 Board Dimensions
with 280-Pin Connector Orientation....................37
Figure 11. Pentium
II 280-Pin Connector - Pin 1
Orientation............................................................38
Figure 12. Printed Circuit Board Thickness..........................39
Figure 13. Pentium
II Processor Mobile Module 3-D
Keep-out Zone.....................................................39
Figure 14. Pentium
II Processor Mobile Module
Thermal Transfer Plate........................................40
Figure 15. Pentium
II Processor Mobile Module
Thermal Transfer Plate........................................41
Figure 16. Standoff Holes, Board Edge Clearance,
and EMI Containment Ring .................................42
Figure 17. Pentium
II Processor Mobile Module
Product Tracking Code........................................44
TABLES
Table 1. Module Connector Signal Summary.........................7
Table 2. Memory Signal Descriptions.....................................9
Table 3. PCI Signal Descriptions ..........................................10
Table 4. Processor/PIIX4E Sideband Signal
Descriptions.............................................................11
Table 5. Power Management Signal Descriptions ...............12
Table 6. Clock Signal Descriptions.......................................13
Table 7. Voltage Descriptions...............................................14
Table 8. JTAG Pins................................................................14
Table 9. Miscellaneous Pins..................................................15
Table 10. Connector Pin Assignments .................................16
Table 11. Connector Specifications......................................19
Table 12. Configuration Straps for the 443BX Host Bridge
System Controller...................................................20
Table 13. Mobile Pentium
II Processor Clock State
Characteristics........................................................24
Table 14. Mobile Pentium
II Processor POS/STR Power..24
Table 15. Pentium
II Processor Mobile Module Power
Specifications 1......................................................25
Table 16. Pentium
II Processor Mobile Module AC
Specifications (BCLK)............................................26
Table 17. BCLK Signal Quality Specifications at the
Processor Core ......................................................27
Table 18. Typical Voltage Regulator Efficiency....................28
Table 19. Voltage Signal Definitions and Sequences..........29
Table 20. Capacitance Requirements per Power Plane......30
Table 21. Thermal Sensor SMBus Address Table...............35
Table 22. Thermal Sensor Configuration Register...............36
Table 23. Pentium
II Processor Mobile Module (MMC-1)
Maximum Power Specifications.............................43
Table 24. Environmental Standards......................................45
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