參數(shù)資料
型號： intel Pentium II processor
廠商： Intel Corp.
英文描述： Pentium II Processor Mobile Module(帶移動模塊奔II處理器)
中文描述： 奔騰II處理器的移動模塊（帶移動模塊奔二處理器）
文件頁數(shù)： 3/46頁
文件大?。?/td> 681K
代理商： INTEL PENTIUM II PROCESSOR
3
Intel
Pentium
II Processor Mobile Module MMC-1
CONTENTS
1.0
1.1
2.0.
3.0
3.1
3.1.1.
3.1.2.
3.1.3.
3.1.4
3.1.5
3.1.6
3.1.7
3.1.8
3.1.9
3.2.
3.3
4.0.
4.1.
4.2.
4.3.
4.3.1.
4.3.2.
4.3.3.
4.3.4
4.4.
4.4.1
4.4.2.
4.4.3.
4.4.4.
4.4.5.
4.4.6.
4.4.7.
4.4.8.
4.5.
4.6.
4.6.1.
INTRODUCTION ..................................................5
Revision History....................................................5
ARCHITECTURE OVERVIEW ............................5
MODULE CONNECTOR INTERFACE................7
Signal Definition....................................................7
Signal List..............................................................8
Memory (108 Signals) ..........................................9
PCI (56 Signals)..................................................10
Processor and PIIX4E Sideband (9 Signals).....11
Power Management (8 Signals).........................12
Clock (8 Signals).................................................13
Voltages (39 Signals) .........................................14
JTAG (7 Signals) ................................................14
Miscellaneous (45 Signals) ................................15
Connector Pin Assignments...............................16
Pin and Pad Assignments..................................18
FUNCTIONAL DESCRIPTION..........................19
Pentium
II Processor Mobile Module...............19
L2 Cache.............................................................19
The 443BX Host Bridge System Controller .......19
Memory Organization.........................................19
Reset Strap Options ...........................................20
PCI Interface.......................................................20
AGP Feature Set ................................................20
Power Management............................................21
Clock Control Architecture..................................21
Normal State.......................................................23
Auto Halt State....................................................23
Stop Grant State.................................................23
Quick Start State.................................................23
HALT/Grant Snoop State ...................................23
Sleep State..........................................................23
Deep Sleep State................................................24
Typical POS/STR Power....................................24
Electrical Requirement .......................................25
DC Requirements...............................................25
4.6.2
AC Requirements................................................26
4.6.2.1.
System Bus Clock (BCLK) Signal
Quality Specifications and
Measurement Guidelines.....................27
Voltage Regulator ...............................................27
4.7.1.
Voltage Regulator Efficiency ..............................27
4.7.2.
Control of the Voltage Regulator........................28
4.7.2.1.
Voltage Signal Definition and
Sequencing............................................29
4.7.3.
Power Planes: Bulk Capacitance Requirements30
4.7.4.
Surge Current Guidelines...................................31
4.7.4.1.
Slew-Rate Control: Circuit
Description............................................33
4.7.4.2.
Under-Voltage Lockout: Circuit
Description (V_uv_lockout)...................34
4.7.4.3.
Over-Voltage Lockout: Circuit
Description (V_ov_lockout)...................35
4.7.4.4.
Over-Current Protection: Circuit
Description ..........................................................35
4.8.
Active Thermal Feedback...................................35
4.9
Thermal Sensor Configuration Register.............36
5.0.
MECHANICAL SPECIFICATION ......................37
5.1.
Module Dimensions ............................................37
5.1.1.
Board Area..........................................................37
5.1.2.
MMC-1 Pin 1 Location ........................................38
5.1.3.
Printed Circuit Board Thickness.........................38
5.1.4.
Height Restrictions..............................................39
5.2.
Thermal Transfer Plate.......................................40
5.3.
Module Physical Support....................................41
5.3.1
Module Mounting Requirements ........................41
5.3.2.
Module Weight ....................................................41
6.0.
THERMAL SPECIFICATION.............................42
6.1.
Thermal Design Power .......................................42
6.2
Thermal Sensor Setpoint....................................42
7.0.
LABELING INFORMATION...............................43
8.0.
ENVIRONMENTAL STANDARDS ....................45
4.7.
相關(guān)PDF資料
PDF描述
INTEL386 CXSA 5-V 32-Bit Fully Static Embedded Microprocessor(5V，32位完全靜態(tài)嵌入式微處理器)
INTEL386 CXSB Low-Voltage, 32-Bit, Fully Static Embedded Microprocessor(低電壓32位完全靜態(tài)嵌入式微處理器)
intel386 DX 32-Bit CHMOS Microprocessor With Integrated Memory Management(32位CHMOS 微處理器帶集成存儲管理)
Intel386 EX Highly Integrated, 32-Bit, Fully Static Embedded Micropocessor(32位高集成完全靜態(tài)嵌入式微處理器)
INTEL386 SXSA 5-V 32-Bit Fully Static Embedded Microprocessor(5V，32位完全靜態(tài)嵌入式微處理器)
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
INTEN I/O PCB 制造商:Sliger Designs, Inc. 功能描述:I/O PCB - Bulk
INTEN LED PCB 制造商:Sliger Designs, Inc. 功能描述:LED PCB - Bulk
INTEN-1-PROTO 制造商:Sliger Designs, Inc. 功能描述:QUANTITY TWO PROTO TYPE SHEET METAL - Bulk
INTENSI-FI 制造商:BOARDCOM 制造商全稱:Broadcom Corporation. 功能描述:DRAFT-802.11n PRODUCT FAMILY
INTER0.5 制造商:POWERDATA TECHNOLOGIES 功能描述:LEAD WIELAND TO WIELAND 0.5M
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺，查看報(bào)價(jià)

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*