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參數(shù)資料
| 型號(hào)： | intel Pentium II processor |
| 廠商： | Intel Corp. |
| 英文描述： | Pentium II Processor Mobile Module(帶移動(dòng)模塊奔II處理器) |
| 中文描述： | 奔騰II處理器的移動(dòng)模塊（帶移動(dòng)模塊奔二處理器） |
| 文件頁(yè)數(shù)： | 38/46頁(yè) |
| 文件大?。?/td> | 681K |
| 代理商： | INTEL PENTIUM II PROCESSOR |
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38
INTEL
PENTIUM
II PROCESSOR MOBILE MODULE MMC-1
5.1.2.
MMC-1 Pin 1 Location
Figure 11 shows the location of pin 1 of the 280-pin MMC-1
as referenced to the adjacent mounting hole.
Secondary Side
Dimensions are in Inches
Figure 11. Pentium
II Processor Mobile Module Board Dimensions with 280-Pin Connector - Pin 1 Orientation
5.1.3.
Printed Circuit Board Thickness
Figure 12 shows the Pentium
II processor mobile module
profile and the associated minimum and maximum thickness
of the printed circuit board (PCB). The range of PCB
thickness allows for different PCB technologies to be used
with current and future Intel mobile modules.
NOTE:
The system manufacturer must ensure that the
mechanical restraining method or system-level EMI contacts
are able to support this range of PCB thickness, to ensure
compatibility with future Intel mobile modules.
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