參數(shù)資料
型號(hào): IDT88P8344BHI
廠商: IDT, Integrated Device Technology Inc
文件頁數(shù): 94/98頁
文件大小: 0K
描述: IC SPI3-SPI4 EXCHANGE 820-PBGA
標(biāo)準(zhǔn)包裝: 24
系列: *
其它名稱: 88P8344BHI
94
IDT88P8344 SPI EXCHANGE 4 x SPI-3 TO SPI-4
INDUSTRIALTEMPERATURERANGE
APRIL 10, 2006
12.3 Device package
The SPI Exchange IDT88P8344 device is packaged in a 35 mm by 35 mm
820-ball one millimeter ball pitch thermally-enhanced plastic ball grid array. All
balls, whether used or unused, must be soldered to pads.
Figure 42. IDT88P8344 820PBGA package, bottom view
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