參數(shù)資料
型號： HC05JJ6GRS
英文描述： 68HC05JJ6 and 68HC05JP6 General Release Specification
中文描述： 68HC05JJ6和68HC05JP6總發(fā)行規(guī)格
文件頁數(shù)： 89/106頁
文件大?。?/td> 1366K
代理商： HC05JJ6GRS
July 16, 1999
GENERAL RELEASE SPECIFICATION
MC68HC05J5A
REV 2.1
MECHANICAL SPECIFICATIONS
For More Information On This Product,
Go to: www.freescale.com
MOTOROLA
12-1
SECTION 12
MECHANICAL SPECIFICATIONS
This section provides the mechanical dimensions for the four available packages
for MC68HC05J5A.
12.1
16-PIN PDIP (CASE #648)
Figure 12-1. 16-Pin PDIP Mechanical Dimensions
12.2
16-PIN SOIC (CASE #751G)
Figure 12-2. 16-Pin SOIC Mechanical Dimensions
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
–A–
B
F
C
S
H
G
D
J
L
M
16 PL
0.25 (0.010)
SEATING
PLANE
1
8
9
16
K
–T–
M
A
M
T
DIM
A
B
C
D
F
G
H
J
K
L
M
S
MIN
0.740
0.250
0.145
0.015
0.040
0.100 BSC
0.050 BSC
0.008
0.110
0.295
0
0.020
MAX
0.770
0.270
0.175
0.021
0.70
MIN
18.80
6.35
3.69
0.39
1.02
MAX
19.55
6.85
4.44
0.53
1.77
MILLIMETERS
INCHES
2.54 BSC
1.27 BSC
0.21
2.80
7.50
0
0.51
0.015
0.130
0.305
10
0.040
0.38
3.30
7.74
10
1.01
DIM
A
B
C
D
F
G
J
K
M
P
R
MIN
10.15
7.40
2.35
0.35
0.50
MAX
10.45
7.60
2.65
0.49
0.90
MIN
0.400
0.292
0.093
0.014
0.020
0.050 BSC
0.010
0.004
0
0.395
0.010
MAX
0.411
0.299
0.104
0.019
0.035
INCHES
MILLIMETERS
1.27 BSC
0.25
0.10
0
10.05
0.25
0.32
0.25
7
10.55
0.75
0.012
0.009
7
0.415
0.029
M
B
M
0.010 (0.25)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
–A–
–B–
P
8X
G
14X
D
16X
SEATING
PLANE
–T–
S
A
M
0.010 (0.25)
B
S
T
16
9
8
1
F
J
R
X 45
M
C
K
F
Freescale Semiconductor, Inc.
n
.
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