參數(shù)資料
型號: C9837AT
廠商: CYPRESS SEMICONDUCTOR CORP
元件分類: 時鐘產(chǎn)生/分配
英文描述: PROC SPECIFIC CLOCK GENERATOR, PDSO48
封裝: TSSOP-48
文件頁數(shù): 10/20頁
文件大?。?/td> 316K
代理商: C9837AT
+/+
…when timing is critical
C9837
Low EMI Clock Generator for Intel
Mobile 133MHz/2 SO-DIMM Chipset Systems
Preliminary
INTERNATIONAL MICROCIRCUITS, INC. 525 LOS COCHES ST.,
Rev 1.0
3/30/2000
MILPITAS, CA 95035, USA TEL: 408-263-6300, FAX 408-263-6571
Page 18 of 20
http://www.imicorp.com
Suggested Oscillator Crystal Parameters
Characteristic
Symbol
Min
Typ
Max
Units
Conditions
Frequency
Fo
14.17
14.31818
14.46
MHz
Tolerance
TC
-
+/-100
PPM
Note 1
Frequency Stability
TS
-
+/- 100
PPM
Stability (TA -10 to +60C) Note 1
Operating Mode
-
Parallel Resonant, Note 1
Load Capacitance
CXTAL
-
20
-
pF
The crystal’s rated load. Note 1
Effective Series
Resistance (ESR)
RESR
-
40
-
Ohms
Note 2
Note1: For best performance and accurate frequencies from this device, It is recommended but not mandatory that the chosen
crystal meets or exceeds these specifications
Note 2: Larger values may cause this device to exhibit oscillator startup problems
To obtain the maximum accuracy, the total circuit loading capacitance should be equal to CXTAL. This loading capacitance is the
effective capacitance across the crystal pins and includes the clock generating device pin capacitance (CFTG), any circuit trace
capacitance (CPCB), and any onboard discrete load capacitance (CDISC).
The following formula and schematic illustrates the application of the loading specification of a crystal (CXTAL)for a design.
CL = (CXINPCB + CXINFTG + CXINDISC) X (CXOUTPCB + CXOUTFTG + CXOUTDISC)
(CXINPCB + CXINFTG + CXINDISC) + (CXOUTPCB + CXOUTFTG + COUTDISC)
Where:
CXTAL
= the load rating of the crystal
CXOUTFTG
= the clock generators XIN pin effective device internal capacitance to ground
CXOUTFTG
= the clock generators XOUT pin effective device internal capacitance to ground
CXINPCB
= the effective capacitance to ground of the crystal to device PCB trace
CXOUTPCB
= the effective capacitance to ground of the crystal to device PCB trace
CXINDISC
= any discrete capacitance that is placed between the XIN pin and ground
CXOUTDISC = any discrete capacitance that is placed between the XOUT pin and ground
C
XINPCB
C
XOUTPCB
C
XOUTDISC
C
XINDISC
C
XINFTG
C
XOUTFTG
XIN
XOUT
Clock Generator
As an example, and using this formula for this datasheet’s device, a design that has no discrete loading capacitors (CDISC) and each
of the crystal to device PCB traces has a capacitance (CPCB) to ground of 4pF (typical value) would calculate as:
CL = (4pF + 36pF + 0pF) X (4pF + 36pF + 0pF)
= 40 x 40
= 1600
= 20pF
(4pF + 36pF + 0pF) + (4pF + 36pF + 0pF)
40 + 40
80
Therefore to obtain output frequencies that are as close to this data sheets specified values as possible, in this design example, you
should specify a parallel cut crystal that is designed to work into a load of 20pF.
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