
AD7294
Data Sheet
Rev. H | Page 10 of 48
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.1 Table 5.
Parameter
Rating
V
PPx to AGND
0.3 V to +70 V
AV
DDx to AGND
0.3 V to +7 V
DAC OUTV+ AB to AGND
0.3 V to +17 V
DAC OUTV+ CD to AGND
0.3 V to +17 V
DV
DD to DGND
0.3 V to +7 V
V
DRIVE to OPGND
0.3 V to +7 V
Digital Inputs to OPGND
0.3 V to V
DRIVE + 0.3 V
SDA/SCL to OPGND
0.3 V to +7 V
Digital Outputs to OPGND
0.3 V to V
DRIVE + 0.3 V
RS(+)/RS() to V
PPx
V
PP 0.3 V to VPP + 0.3 V
REF
OUT/REFIN ADC to AGND
0.3 V to AV
DD + 0.3 V
REF
OUT/REFIN DAC to AGND
0.3 V to AV
DD + 0.3 V
OPGND to AGND
0.3 V to +0.3 V
OPGND to DGND
0.3 V to +0.3 V
AGND to DGND
0.3 V to +0.3 V
V
OUTx to AGND
0.3 V to DAC OUTV(+) + 0.3 V
Analog Inputs to AGND
0.3 V to AV
DD + 0.3 V
Operating Temperature Range
B Version
40°C to +105°C
Storage Temperature Range
65°C to +150°C
Junction Temperature (T
J Max)
150°C
ESD Human Body Model
1 kV
Reflow Soldering Peak
Temperature
260°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
To conform with IPC 2221 industrial standards, it is advisable
to use conformal coating on the high voltage pins.
THERMAL RESISTANCE
Table 6. Thermal Resistance
Package Type
θ
JA
θ
JC
Unit
64-Lead TQFP
54
16
°C/W
56-Lead LFCSP
21
2
°C/W
ESD CAUTION
1 Transient currents of up to 100 mA do not cause SCR latch-up.