
W83977EF/ CTF
PRELIMINARY
Publication Release Date: March 1999
-152 -
Revision A1
16.0 PACKAGE DIMENSIONS
(128-pin PQFP)
L
L
1
Detail F
c
e
b
1
38
H
D
D
39
64
H
E
E
102
65
1.Dimension D & E do not include interlead
flash.
2.Dimension b does not include dambar
protrusion/intrusion
3.Controlling dimension : Millimeter
4.General appearance spec. should be based
5. PCB layout please use the "mm".
.
Note:
Seating Plane
See Detail F
y
A
A
1
A
2
128
103
Symbol
b
c
D
E
e
H
D
H
E
L
L
1
y
0
A
A
1
2
7
0
0.08
1.60
0.95
17.40
0.80
17.20
0.65
17.00
14.10
0.20
0.30
2.87
14.00
2.72
0.50
13.90
0.10
0.10
2.57
0.25
Min
Nom
Max
Dimension in mm
0.20
0.15
19.90
20.00
20.10
23.00
23.20
23.40
0.35
0.45
0.003
0
0.063
0.037
0.685
0.031
0.677
0.025
0.669
0.020
0.555
0.008
0.012
0.113
0.551
0.107
0.547
0.004
0.004
0.101
0.010
Max
Nom
Min
Dimension in inch
0.006
0.008
7
0.783
0.787
0.791
0.905
0.913
0.921
0.014
0.018
Headquarters
No. 4, Creation Rd. III,
Science-Based Industrial Park,
Hsinchu, Taiwan
TEL: 886-3-5770066
FAX: 886-3-5792646
http://www.winbond.com.tw/
Voice & Fax-on-demand: 886-2-27197006
Taipei Office
11F, No. 115, Sec. 3, Min-Sheng East Rd.,
Taipei, Taiwan
TEL: 886-2-27190505
FAX: 886-2-27197502
Winbond Electronics (H.K.) Ltd.
Rm. 803, World Trade Square, Tower II,
123 Hoi Bun Rd., Kwun Tong,
Kowloon, Hong Kong
TEL: 852-27513100
FAX: 852-27552064
Winbond Electronics North America Corp.
Winbond Memory Lab.
Winbond Microelectronics Corp.
Winbond Systems Lab.
2727 N. First Street, San Jose,
CA 95134, U.S.A.
TEL: 408-9436666
FAX: 408-5441798
Note: All data and specifications are subject to change without notice.
Please note that all data and specifications are subject to change without notice. All the
trade marks of products and companies mentioned in this data sheet belong to their original
owners.