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參數(shù)資料
| 型號(hào)： | UPD61052 |
| 廠商： | NEC Corp. |
| 英文描述： | MOS INTEGRATED CIRCUIT MPEG2 AUDIO/VIDEO ENCODER |
| 中文描述： | 馬鞍山集成電路MPEG2音頻/視頻編碼器 |
| 文件頁數(shù)： | 103/106頁 |
| 文件大?。?/td> | 824K |
| 代理商： | UPD61052 |
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Data Sheet S15082EJ4V0DS
103
μ
PD61051, 61052
8.
RECOMMENDED SOLDERING CONDITIONS
The
μ
PD61051, 61052 should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Table 8-1. Surface-Mounted Soldering Conditions
μ
PD61051GD-LML:
μ
PD61051GD-LML-A
μ
PD61052GD-LML:
μ
PD61052GD-LML-A
Soldering Method
208-pin plastic QFP (Fine pitch) (28
×
28)
208-pin plastic QFP (Fine pitch) (28
×
28)
208-pin plastic QFP (Fine pitch) (28
×
28)
208-pin plastic QFP (Fine pitch) (28
×
28)
Note1
:
Note1
:
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235°C
IR35-207-3
Time: 30 sec. max. (at 210°C or higher)
Count: Three times or fewer
Exposure limit: 7 days
Note2
(After that, prebake at 125°C for 20 to 72 hours)
VPS
Package peak temperature: 215°C
VP15-207-3
Time: 40 sec. max. (at 200°C or higher)
Count: Three times or fewer
Exposure limit: 7 days
Note2
(After that, prebake at 125°C for 20 to 72 hours)
Partial heating
Pin temperature: 300°C max.
Time: 3 sec. max. (per pin row)
Notes 1.
Lead-free product
2.
After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use two or more soldering methods in combination (except for partial heating method).
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