參數(shù)資料
型號(hào)： SC16C752IB48,157
廠商： NXP Semiconductors
文件頁(yè)數(shù)： 40/47頁(yè)
文件大?。?/td> 0K
描述： IC DUAL UART 64BYTE 48LQFP
標(biāo)準(zhǔn)包裝： 1,250
通道數(shù)： 2，DUART
FIFO's： 64 字節(jié)
電源電壓： 2.5V，3.3V，5V
帶自動(dòng)流量控制功能： 是
帶故障啟動(dòng)位檢測(cè)功能： 是
帶調(diào)制解調(diào)器控制功能： 是
安裝類型： 表面貼裝
封裝/外殼： 48-LQFP
供應(yīng)商設(shè)備封裝： 48-LQFP（7x7）
包裝： 托盤(pán)
其它名稱： 935270055157
SC16C752IB48
SC16C752IB48-ND
Philips Semiconductors
SC16C752
Dual UART with 64-byte FIFO
Product data
Rev. 04 — 20 June 2003
45 of 47
9397 750 11635
Koninklijke Philips Electronics N.V. 2003. All rights reserved.
[3]
These transparent plastic packages are extremely sensitive to reow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reow
soldering with peak temperature exceeding 217
°C ± 10 °C measured in the atmosphere of the reow
oven. The package body peak temperature must be kept as low as possible.
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is denitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is denitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
14. Revision history
Table 28:
Revision history
Rev Date
CPCN
Description
04
20030620
-
Product data (9397 750 11635); ECN 853-2379 30031 of 16 June 2003.
Modications:
added connection with resistor.
03
20030313
-
Product data (9397 750 11196); ECN 853-2379 29623 of 10 March 2003.
02
20021216
-
Product data (9397 750 10811); ECN 853-2379 29261 of 06 December 2002.
01
20020910
-
Product data (9397 750 09575); ECN 853-2379 28891 of 10 September 2002.
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參數(shù)描述
SC16C754 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Quad UART with 64-byte FIFO
SC16C754B 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 64-byte FIFOs
SC16C754BIA68 功能描述:UART 接口集成電路 16CB 2.5V-5V 4CH UART 64B FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC16C754BIA68,512 功能描述:UART 接口集成電路 16CB 2.5V-5V 4CH RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC16C754BIA68,518 功能描述:UART 接口集成電路 4CH. UART 64B FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
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