參數(shù)資料
型號(hào)： PowerPC 740
廠商： IBM Microeletronics
英文描述： 32-Bit Embedded Microprocessor(32位精簡(jiǎn)指令集嵌入式微處理器)
中文描述： 32位嵌入式微處理器（32位精簡(jiǎn)指令集嵌入式微處理器）
文件頁數(shù)： 3/48頁
文件大小： 608K
代理商： POWERPC 740
12/8/99
Version 1.02
Page 3
PowerPC 740 and PowerPC 750 Microprocessor
CMOS 0.20
μ
m Copper Technology, PID-8p, PPC740L and PPC750L, dd3.2
Table of Contents
Preface .....................................................................................................................................................4
New Features for dd3.x ............................................................................................................................4
Overview ...................................................................................................................................................5
Features ...................................................................................................................................................6
General Parameters .................................................................................................................................8
Electrical and Thermal Characteristics .....................................................................................................9
DC Electrical Characteristics ................................................................................................................9
AC Electrical Characteristics ..................................................................................................................13
Clock AC Specifications ......................................................................................................................13
60x Bus Input AC Specifications .........................................................................................................14
60x Bus Output AC Specifications ......................................................................................................16
L2 Clock AC Specifications .................................................................................................................18
L2 Bus Input AC Specifications ...........................................................................................................20
L2 Bus Output AC Specifications ........................................................................................................21
IEEE 1149.1 AC Timing Specifications ..................................................................................................22
PowerPC 740 Microprocessor Pin Assignments ....................................................................................24
PowerPC 740 Microprocessor Pinout Listings .......................................................................................25
PowerPC 740 Package ..........................................................................................................................28
Mechanical Dimensions of the PowerPC 740 255 CBGA Package ....................................................29
PowerPC 750 Microprocessor Pin Assignments ....................................................................................30
PowerPC 750 Package ..........................................................................................................................33
Mechanical Dimensions of the PowerPC 750 360 CBGA Package ....................................................34
System Design Information ....................................................................................................................36
PLL Configuration ...............................................................................................................................36
PLL Power Supply Filtering .................................................................................................................37
Decoupling Recommendations ...........................................................................................................37
Connection Recommendations ...........................................................................................................37
Output Buffer DC Impedance ..............................................................................................................38
Pull-up Resistor Requirements ...........................................................................................................39
Thermal Management Information ......................................................................................................40
Internal Package Conduction Resistance ...........................................................................................41
Heat Sink Selection Example ..............................................................................................................44
Ordering Information ...............................................................................................................................46
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