參數(shù)資料
型號: PowerPC 740
廠商: IBM Microeletronics
英文描述: 32-Bit Embedded Microprocessor(32位精簡指令集嵌入式微處理器)
中文描述: 32位嵌入式微處理器(32位精簡指令集嵌入式微處理器)
文件頁數(shù): 29/48頁
文件大?。?/td> 608K
代理商: POWERPC 740
12/8/99
Version 1.02
Page29
PowerPC 740 and PowerPC 750 Microprocessor
CMOS 0.20
μ
m Copper Technology, PID-8p, PPC740L and PPC750L, dd3.2
Mechanical Dimensions of the PowerPC 740 255 CBGA Package
Figure 14. Mechanical Dimensions and Bottom Surface Nomenclature of the 255 CBGA
Package
NOTES:
1.
DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
DIMENSIONS IN MILLIMETERS.
TOP SIDE A1 CORNER INDEX IS A
METALIZED FEATURE WITH VARIOUS
SHAPES. BOTTOM SIDE A1 CORNER IS
DESIGNATED WITH A BALL MISSING FROM
2.
3.
DIM
A
A1
A2
b
D
D1
e
E
E1
MIN
2.45
0.80
0.90
0.82
21.00 BSC
5.443 BSC
1.27 BSC
21.00 BSC
8.075 BSC
MAX
3.00
1.00
1.10
0.93
MILLIMETERS
A
A1
A2
C
0.15 C
B
C
C
255X
e
1 2 3 4 5 6 7 8 9 10111213141516
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
e/2
A
0.3
0.15
b
e/2
0.2
D
2X
A1 CORNER
E
E1
D1
0.2
2X
B
A
There is no ball
in the A01 position
A1 CORNER
Top View
X-ray view of balls
from top of package
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